Results 21 to 30 of about 39,226 (228)
Packaging technology enabling flexible optical interconnections [PDF]
This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials.
Bosman, Erwin +5 more
core +1 more source
Computational Study of the Coupling Performances for a Long-Distance Vertical Grating Coupler
We present a high-efficiency silicon grating coupler design based on a left–right mirror-symmetric grating and a metal mirror. The coupler achieves nearly perfect 90-degree vertical coupling.
Zhonghua Yang, Wenbo Luo, Yu Sun
doaj +1 more source
200G VCSEL Development and Proposal of Using VCSELs for Near-Package-Optics Scale-Up Application
The connectivity demands of high-performance computing (HPC), artificial intelligence (AI) and data centers are driving the development of a new generation of multimode optical components.
Tzu Hao Chow +11 more
doaj +1 more source
Features of DLW-STED nanolithography for quantum optics [PDF]
The report proposes a discussion of the effective combination of two current trends: the additive 3D printing method and the development of multicomponent photonic schemes, as well as the development of the foundations of additive scalable and flexible ...
Vitukhnovsky A.G. +3 more
doaj +1 more source
Integrated Components and Solutions for High-Speed Short-Reach Data Transmission
According to different transmission distances, application scenarios of a data center mainly include intra- and inter-data center optical interconnects.
Lin Jiang +7 more
doaj +1 more source
InP-Based Foundry PICs for Optical Interconnects
This paper describes a fabrication process for realizing Indium-Phosphide-based photonic-integrated circuits (PICs) with a high level of integration to target a wide variety of optical applications.
Francisco M. Soares +7 more
doaj +1 more source
We put forward and demonstrate a silicon photonics (SiPh)-based mode division multiplexed (MDM) optical power splitter that supports transverse-electric (TE) single-mode, dual-mode, and triple-mode (i.e., TE0, TE1, and TE2).
Yuan-Zeng Lin +6 more
doaj +1 more source
Graded-index polymer multimode waveguides for 100 Gb/s board-level data transmission [PDF]
We report enhanced graded-index multimode polymer waveguides with >70GHz×m for MMF launch and >200GHz×m for restricted launch, indicating the capability of on-board waveguide transmission of >100 Gb/s.
Bamiedakis, Nikos +6 more
core +2 more sources
CMOS-compatible graphene photodetector covering all optical communication bands
Optical interconnects are becoming attractive alternatives to electrical wiring in intra- and inter-chip communication links. Particularly, the integration with silicon complementary metal-oxide-semiconductor (CMOS) technology has received considerable ...
Bachmann, Dominic +6 more
core +2 more sources
Optical Interconnection Networks Based on Microring Resonators [PDF]
— Interconnection networks must transport an always increasing information density and connect a rising number of processing units. Electronic technologies have been able to sustain the traffic growth rate, but are getting close to their physical limits.
Bianco, Andrea +6 more
core +2 more sources

