Results 221 to 230 of about 359,176 (290)

High-speed graphene-based sub-terahertz receivers enabling wireless communications for 6G and beyond. [PDF]

open access: yesNat Commun
Soundarapandian KP   +15 more
europepmc   +1 more source

Ultrabroadband and Highly Sensitive Short‐Wave Infrared Molecular Fingerprinting via Acoustic MXene Plasmons

open access: yesAdvanced Science, EarlyView.
Acoustic plasmons in Ti3C2Tx MXene strongly compress infrared electromagnetic fields and enhance light–matter interactions at the nanoscale. This platform couples broadband plasmon excitations with molecular vibrations, enabling simultaneous sensing of high‐ and low‐frequency vibrational modes in ultrathin PMMA and graphene oxide films, and extending ...
Changhoon Park   +7 more
wiley   +1 more source

Self‐Powered Bearing Sensing and Real‐Time Fault Diagnosis Enabled by Non‐Invasive Triboelectric Sensors and Edge AI Acceleration

open access: yesAdvanced Science, EarlyView.
This study achieves the synergistic integration of self‐powered sensing and edge AI acceleration to establish a real‐time fault diagnosis system. The proposed TENG‐based self‐powered bearing sensor (NSE‐TBS) and FPGA‐accelerated edge AI framework fundamentally break through the inherent limitations of conventional monitoring systems, including complex ...
Kehui Zhu   +7 more
wiley   +1 more source

Defect Driven Electronic Structure Reconfiguration and Hierarchical Phonon Suppression in Ag2Se Thermoelectrics

open access: yesAdvanced Science, EarlyView.
Indium substitution in Ag2Se nanocrystals simultaneously tailors electronic structure and lattice dynamics. Fermi‐level upshift and band‐gap narrowing enhance electrical transport, while defect‐induced lattice softening intensifies phonon scattering and suppresses lattice thermal conductivity.
Yineng Gou   +11 more
wiley   +1 more source

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

open access: yesAdvanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen   +7 more
wiley   +1 more source

New design of a high-efficiency rectenna for wireless power transfer in 5G applications. [PDF]

open access: yesSci Rep
Hamadi HB   +7 more
europepmc   +1 more source

Electrostatic Self‐Assembly Induced Nest‐Like MXene Networks on Fabric for Ultra‐Broadband Flexible Absorption

open access: yesAdvanced Science, EarlyView.
In this study, an electrostatically self‐assembled WPU‐MXene@FC flexible fabric constructs a “nest‐like” structure on fibers, building construct MXene multiple loss paths, achieving ultra‐wideband absorption of 25.3–1200 GHz in a thickness of 1.8 mm, while also exhibiting superhydrophobicity, acid and alkali resistance, and bending resistance ...
Min Luo   +7 more
wiley   +1 more source

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