Results 61 to 70 of about 26,581 (261)
Planar Solid‐State Nanopores Toward Scalable Nanofluidic Integration Based on CMOS Technology
We present a scalable silicon‐based fabrication strategy for planar solid‐state nanopores to enable their integration with complex nanofluidic systems. Prototype devices demonstrate normal voltage‐current characteristics, good noise performance, and appreciable streaming currents. Our CMOS‐compatible fabrication process offers precise geometric control
Ngan Hoang Pham +7 more
wiley +1 more source
Some Constructions for Amicable Orthogonal Designs [PDF]
Hadamard matrices, orthogonal designs and amicable orthogonal designs have a number of applications in coding theory, cryptography, wireless network communication and so on. Product designs were introduced by Robinson in order to construct orthogonal designs especially full orthogonal designs (no zero entries) with maximum number of variables for some ...
openaire +3 more sources
Programmable design of orthogonal protein heterodimers [PDF]
Specificity of interactions between two DNA strands, or between protein and DNA, is often achieved by varying bases or side chains coming off the DNA or protein backbone-for example, the bases participating in Watson-Crick pairing in the double helix, or the side chains contacting DNA in TALEN-DNA complexes.
Zibo Chen +17 more
openaire +2 more sources
This study explores the lightweight potential of laser additive‐manufactured NiTi triply periodic minimal surface sheet lattices. It systematically investigates the effects of relative density and unit cell size on surface quality, deformation recovery, compression behavior, and energy absorption.
Haoming Mo +3 more
wiley +1 more source
On Sequences with Zero Autocorrelation and Orthogonal Designs
An orthogonal design of order \(n\) and type \((s_1, s_2,\dots, s_n)\) \((s_i> 0)\), denoted \(\text{OD}(n; s_1,s_2,\dots, s_n)\), on the commuting variables \(x_1,x_2,\dots, x_n\) is an \(n\times n\) matrix \(A\) with entries in \(\{0,\pm x_1,\dots,\pm x_n\}\) such that \[ AA^T= \Biggl(\sum^n_{i=1} s_i x^2_i\Biggr) I_n.
Stelios Georgiou, Christos Koukouvinos
openaire +1 more source
Near‐Field Electrospinning Micro‐Printhead Achieves Precise Control of Nanofiber Deposition
A micro‐printhead for near‐field electrospinning enables reproducible deposition of polymer nanofibers with diameters below 50 nm. Systematic parameter studies uncover the mechanisms linking operating conditions to fiber morphology, paving the way for precise and low‐cost nanoscale 3D manufacturing.As a high‐resolution, cost‐effective, and rapid ...
Han Xu, Dario Mager, Jan G. Korvink
wiley +1 more source
On Designs with Pencilwise Orthogonality and Balance
Suppose we have a factorial experiment with m factors where the ith factor has Si levels, i = 1, 2,…, m. The v = mIIi=1 Si level combinations laid out in a v × b block design D with block sizes k1, k2,…, kb and replications ri,r2,…, rv. The C-matrix for the design is given by C = rδ−Nk−δN1 (1) where rδ =diag(r1,r2,…,rv) k−δ=diag(k−11, k−11 ...
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Phase‐field simulations coupled with dislocation‐density‐based crystal plasticity modeling reproduce γ′ rafting behavior in single‐crystal Ni‐based superalloys under varied loading conditions. The model captures both macroscopic creep and microscopic morphology evolution, with results matching high‐temperature creep experiments.
Micheal Younan +5 more
wiley +1 more source
Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich +3 more
wiley +1 more source
Creep‐Induced Microstructural Evolution in an A2‐B2 Superalloy
A 27.3Ta‐27.3Mo‐27.3Ti‐8Cr‐10Al (at.%) refractory high‐entropy alloy with precipitation‐strengthened A2‐B2 microstructure was studied by creep tests at 1030°C, which demonstrate a transition in deformation mechanisms in the range of 100–150 MPa applied stress. This is associated with changes in dislocation–precipitate interactions. Relevant deformation
Liu Yang +10 more
wiley +1 more source

