Results 331 to 340 of about 2,059,114 (391)

Cactus-Based Biopolymers: A Review on Sustainable Innovations in Edible Packaging, UV Protection, Antioxidant Films, and Industrial Applications. [PDF]

Food Sci Nutr
Teferi DA, Kassa MG.
europepmc   +1 more source

Supplementary package for paper "Software Vulnerability Management in the Era of Artificial Intelligence: An Industry Perspective"

M. Mehdi Kholoosi, Triet Huynh Minh Le, Ali Babar   +2 more
openalex   +1 more source

Xanthan Gum-Driven Innovations for Reinventing Food Preservation. [PDF]

Polymers (Basel)
Tabassum Z, Anand A, Bhanot R, Girdhar M, Kumar A, Mamidi N, Mohan A.   +6 more
europepmc   +1 more source

Chitosan-graphene oxide films as a promising packaging material for the preservation of fresh plums (<i>Prunus salicina</i> Lindl.). [PDF]

RSC Adv
Doan Trang TY, Suong PK, Van Thiet D, Tung NQ, Thi-Dung H, Lan VP, Huu NT, Hanh DT.   +7 more
europepmc   +1 more source

Evaluation of Quality and Storage Characteristics of Freeze-Dried Powdered Mycelium Sausages According to Packaging Methods. [PDF]

Foods
Oh YN, Kim HY.
europepmc   +1 more source

Sustainable strategies for using natural extracts in smart food packaging

Samira Sheibani, Shima Jafarzadeh, Zeinab Qazanfarzadeh, M.M. Jeevani Osadee Wijekoon, Norazatul Hanim Mohd Rozalli, Abdorreza Mohammadi Nafchi   +5 more
openalex   +1 more source

Symmetry packaging II: Packaged subspaces, packaged entanglement, and classification

Nuclear Physics B
openaire   +1 more source

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Recent Advances and Trends in Advanced Packaging

IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2022
In this study, advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2-D, 2.1-D, 2.3-D, 2.5-D, and 3-D IC integration, which will be presented and ...
J. Lau
semanticscholar   +1 more source

Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review

Advances in Materials, 2022
The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation.
Yingfeng Wen, Chao Chen, Yunsheng Ye, Zhigang Xue, Hongyuan Liu, Xingping Zhou, Yun Zhang, Dequn Li, Xiaolin Xie, Y. Mai   +9 more
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Antimicrobial nanoparticles and biodegradable polymer composites for active food packaging applications.

Comprehensive Reviews in Food Science and Food Safety, 2021
The food industry faces numerous challenges to assure provision of tasty and convenient food that possesses extended shelf life and shows long-term high-quality preservation.
Nejra Omerović, Mila Djisalov, K. Živojević, M. Mladenović, Jovana Vunduk, I. Milenković, N. Knežević, I. Gadjanski, J. Vidić   +8 more
semanticscholar   +1 more source