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Variation of polish pad shape during pad dressing

Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 1999
Abstract In silicon wafer polishing and CMP processes, polish pad dressing (conditioning) is often used to restore pad performance. In this report, variation of polish pad shape during dressing is studied by using diamond-plated cup wheels and sandpaper rings, respectively. Result shows that pad shape becomes concave after certain amount of dressing.
Yi-yang Zhou, Eugene C Davis
exaly   +2 more sources

A Study on the Dressing Rate in CMP Pad Conditioning

Key Engineering Materials, 2004
Pei Lum Tso
exaly   +2 more sources

A Novel Technique for Dressing Fixed Abrasive Lapping Pad with Abrasive Water Jet

International Journal of Precision Engineering and Manufacturing - Green Technology, 2023
Mingchao Liang   +2 more
exaly   +2 more sources

Single Diamond Dressing Characteristics of CMP Polyurethane Pad

Key Engineering Materials, 2007
The fundamental characteristics of dressing action on the polyurethane pad are investigated via dressing by single diamond of different orientations, dressing parameters and dressing path in this study. Experimental results show that a groove with pile-up on both side walls forms as the diamond moves over the pad with a specific dressing depth.
James C Sung, Yunn Shiuan Liao
exaly   +2 more sources

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