Results 211 to 220 of about 252,309 (284)

Unlocking Three‐Dimensional Electron and Ion Transport in High‐Loading and Dense Lithium‐Ion Battery Electrodes Assisted via Porous Graphene Networks

Advanced Energy Materials, EarlyView.
Graphene mesosponge (GMS) enables three‐dimensional electron and ion transport in high‐loading, densely packed lithium‐ion‐battery electrodes through its unique mesoporous structure. The three‐dimensionally interconnected carbon network and electrolyte retained within the GMS mesopores ensure efficient electronic and ionic conduction, respectively ...
Yosuke Ugata, Rei Matsumoto, Sera Sato, Jaejin Lim, Yong Min Lee, Hiroshi Ueda, Atsuo Omaru, Kosuke Ishii, Naoaki Yabuuchi   +8 more
wiley   +1 more source

Reconfigurable Selector-Only Memory (SOM) for Scalable Neuromorphic Computing. [PDF]

Adv Sci (Weinh)
Wen JY, Yi CQ, Zhang YR, Wang BH, Liu ZX, Zhou CY, Tong H, Miao XS.   +7 more
europepmc   +1 more source

Counter‐Halide‐Directed Ion‐Pair Passivation Enables High‐Performance Wide‐Bandgap Perovskites for Perovskite/Cu(in,Ga)Se2 Tandem Solar Cells

Advanced Energy Materials, EarlyView.
Counter‐halide engineering of fluorobenzylammonium surface passivators reveals bromide as the optimal partner for wide‐bandgap perovskites. FBz–Br effectively stabilizes halide‐vacancy‐related defects and undercoordinated Pb sites, suppresses non‐radiative recombination, and enhances surface hydrophobicity and thermal stability.
Huyen Tran, Dong Gyu Lee, Ahreum Lee, Inchan Hwang, Van Hung Tran, Jun Hyeok Choi, Junseop Byeon, Yu Jin Kim, Sang Hwan Nam, Jihye Gwak, Seung Kyu Ahn, Sungjun Hong, Kihwan Kim, Bong Joo Kang, Minwoo Park, SeJin Ahn, Tae Kyung Lee, Inyoung Jeong   +17 more
wiley   +1 more source

Parametric Analysis of Spiking Neurons in 16 nm Fin Field‐Effect Transistor Technology

Advanced Intelligent Discovery, EarlyView.
Energy efficient computing has driven a shift toward brain‐inspired neuromorphic hardware. This study explores the design of three distinct silicon neuron topologies implemented in 16 nm fin field‐Effect transistor technology. While the Axon‐Hillock design achieves gigahertz throughput, its functional fragility persists. The Morris–Lecar model captures
Logan Larsh, Raiyan Siddique, Sarah S. Sharif, Yaser Mike Banad   +3 more
wiley   +1 more source

Ferroelectric Dynamic-Field-Driven Nucleation and Growth Model for Predictive Materials-To-Circuit Co-Design. [PDF]

Adv Mater
Liang Y, Kim S, Chiang T, Lenox MK, Mercer I, Plombon JJ, Maria JP, Ihlefeld JF, Sun W, Lu W, Heron JT.   +10 more
europepmc   +1 more source

A Two‐Stage Characterization Pipeline and Open‐Source Framework for Reproducible Tactile Sensing

Advanced Intelligent Systems, EarlyView.
The same soft tactile sensor returns different numbers when embodied in different robots. This is an Embodiment Gap that no shared framework currently captures transparently. A two‐stage characterization pipeline, paired with a FAIR open‐source digital datasheet, decouples intrinsic sensor behavior from embodiment effects and condenses cross‐laboratory
Matteo Lo Preti, Weng Buxiu, Petr Trunin, Muhammad Sunny Nazeer, Lucia Beccai, Perla Maiolino, Cecilia Laschi   +6 more
wiley   +1 more source

An Improved Nonlinear Capacitance Model for GaN HEMTs Based on the Angelov Model. [PDF]

Micromachines (Basel)
Miao Y, Yuan Q, Wang C, Cheng J.
europepmc   +1 more source

Modeling and Design of a Soft Capacitive Slip Sensor with Fluid Dielectric Interlayer. [PDF]

Micromachines (Basel)
Landi E, Lisini Baldi T, Pallaoro M, Micheletti F, Carli F, Fort A.   +5 more
europepmc   +1 more source

Development of a High-Frequency, High-Temperature Class-A Amplifier Based on a Silicon Carbide Static Induction Transistor. [PDF]

Sensors (Basel)
Scardelletti MC, Grgat JR, Zorman CA.
europepmc   +1 more source

A low-cost modular PCB assembly for functional and in-circuit testing. [PDF]

HardwareX
Puentes-Conde GM, Sifuentes E, Molina J, Enríquez-Aguilera F, Bravo G, Ávila AH.   +5 more
europepmc   +1 more source