Results 251 to 260 of about 127,295 (353)

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

Strengths, weaknesses, opportunities and threats of mobile applications in undergraduate nursing: a scoping review protocol. [PDF]

open access: yesPLoS One
Dantas AC   +6 more
europepmc   +1 more source

W‐Based Thin Film Metallic Glasses Doped with Ni, Zr, and B for Industrial Applications

open access: yesAdvanced Engineering Materials, EarlyView.
This work is the first to deal with a comprehensive comparison of two metallic glass systems, W–Zr–B and W–Ni–B, in terms of their suitability for specific industrial applications. Their mechanical and tribological properties are compared and discussed in combination with structural homogeneity on different types of technically relevant substrates and ...
Zbynek Studeny   +5 more
wiley   +1 more source

Sol–Gel Synthesis of Ca2.5Ag0.3Sm0.2Co4O9 Semiconducting Materials for Thermoelectric Applications in Aerospace Systems

open access: yesAdvanced Engineering Materials, EarlyView.
Ca2.5Ag0.3Sm0.2Co4O9 semiconductor materials are synthesized and produced in this study using the sol–gel and cold pressing techniques for thermoelectric generator applications. As template samples are added, the Seebeck coefficient and power factor values rise, peaking at 800 °C for Ca2.5Ag0.3Sm0.2Co4O9 at 274.47 μV K−1 and 0.58 mW mK−2, respectively.
Enes Kilinc   +4 more
wiley   +1 more source

Home - About - Disclaimer - Privacy