Results 251 to 260 of about 272,073 (332)

Retrospective Review on Reticular Materials: Facts and Figures Over the Last 30 Years

open access: yesAdvanced Materials, EarlyView.
To shape the future course of research in reticular materials, this work reflects on the progress over the past 30 years, complemented by input from the community of 228 active researchers through a global, crowdsourced survey: ranging from demographics, how it works, publish and interact, to highlights on both academic and industrial milestones, as ...
Aamod V. Desai   +8 more
wiley   +1 more source

Advancements in Understanding the Physicochemical Properties of Reticular Materials: An In Situ and Operando Spectroscopic Perspective

open access: yesAdvanced Materials, EarlyView.
This review explores how in situ and operando spectroscopic techniques reveal the real‐time behavior of reticular materials, including MOFs and COFs. These methods track material formation and functionalization, structural changes, defect formation, dynamic responses to external triggers, and catalytic processes.
Bettina Baumgartner   +4 more
wiley   +1 more source

Immunomodulator loaded microneedle arrays for targeted intradermal drug delivery to skin tumors. [PDF]

open access: yesDrug Deliv
Sabri AH   +10 more
europepmc   +1 more source

State‐of‐the‐Art, Insights, and Perspectives for MOFs‐Nanocomposites and MOF‐Derived (Nano)Materials

open access: yesAdvanced Materials, EarlyView.
Different approaches to MOF‐NP composite formation, such as ship‐in‐a‐bottle, bottle‐around‐the‐ship and in situ one‐step synthesis, are used. Owing to synergistic effects, the advantageous features of the components of the composites are beneficially combined, and their individual drawbacks are mitigated.
Stefanos Mourdikoudis   +6 more
wiley   +1 more source

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

open access: yesAdvanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa   +9 more
wiley   +1 more source

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