Results 121 to 130 of about 27,619 (295)

Electrochemically‐Assisted Low Power Density Laser Writing on Stainless Steel via Enrichment of Chromium Oxides

open access: yesAdvanced Materials Interfaces, EarlyView.
This research describes the invention of a new method to color the surface of stainless steel with brown to blue hues at micron resolution using a low‐power laser. This method is safer and lower cost than previous methods. The study determines that the main coloring compound is chromium oxide.
Zechariah J. Pfaffenberger   +4 more
wiley   +1 more source

Combining X‐Ray Photoelectron and Absorption Spectroscopies for Determining Surface Chemistry and Composition of Ti3C2Tx MXene

open access: yesAdvanced Materials Interfaces, EarlyView.
The surface chemistry and core composition of Ti3C2Tx MXenes is often derived from X‐ray Photoelectron Spectroscopy (XPS) but its determination and quantification remain difficult due to adsorbed species such as adventitious carbon. This challenge is overcome by using energy‐dependent XPS and depth profile modeling of the Ti3C2Tx MXene surface ...
Zoé Dessoliers   +7 more
wiley   +1 more source

4D Bioprinted Self‐Folding Scaffolds Enhance Cartilage Formation in the Engineering of Trachea

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A bilayer self‐folding scaffold, triggerable by humidity, is fabricated via 4D bioprinting for trachea engineering. An analytical model is derived to predict its radius of curvature, enabling its scalability. Cartilage progenitor cells seeded on the scaffold perceive scaffold final curvature and react to it, by enhancing the upregulation of pro ...
Irene Chiesa   +4 more
wiley   +1 more source

Magnetic Force‐Induced Self‐Assembly and Flip‐Chip Alignment on Electroplated Multilayer Solder with Tailored Melting Points

open access: yesAdvanced Materials Technologies, EarlyView.
This work demonstrates fluidic self‐assembly and self‐alignment of flip‐chips using a magnetic field for agitation and orientation. Pb‐free solder bumps with tailored transformation imprinted melting points enable selective capturing on low‐melting solder in water. After capturing, final alignment is achieved through magnetic forces.
Mahsa Kaltwasser   +3 more
wiley   +1 more source

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