Results 201 to 210 of about 151,992 (343)

Charge Injection for Polarization Screening at Electrode Interfaces and the Antiferroelectric Double Hysteresis Loop of La‐Doped Pb(Zr,Sn,Ti)O3

open access: yesAdvanced Materials Interfaces, EarlyView.
Screening of the bound polarization charges of ferroelectrics at electrode interfaces is accommodated either by electrode charges or by charge injection. By means of X‐ray photoelectron spectroscopy with in‐situ polarization reversal, it is demonstrated that screening charges at antiferroelectric La‐doped Pb(Zr,Ti)O3 are injected, while they remain at ...
Binxiang Huang   +6 more
wiley   +1 more source

Research trends of piezoelectric materials in neurodegenerative disease applications. [PDF]

open access: yesBioact Mater
Wang X   +8 more
europepmc   +1 more source

Fully Transparent Flexible Piezoelectric Sensing Materials Based on Electrospun PVDF and Their Device Applications [PDF]

open access: bronze
Xunlin Qiu   +7 more
openalex   +1 more source

Design, Analysis and Finite Element Modeling of Macro Fiber Composite Piezoelectric Materials

open access: bronze, 2020
Dounia Fadlaoui   +3 more
openalex   +1 more source

Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors

open access: yesAdvanced Materials Interfaces, EarlyView.
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini   +4 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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