Results 171 to 180 of about 3,673 (237)

Meissner Effect and Nonreciprocal Charge Transport in Non‐Topological 1T‐CrTe2/FeTe Heterostructures

open access: yesAdvanced Materials, Volume 38, Issue 14, 6 March 2026.
This work demonstrates interface‐induced superconductivity (Tc ∼12 K) with a robust Meissner effect and pronounced nonreciprocal transport in epitaxial 1T‐CrTe2/FeTe heterostructures, where 1T‐CrTe2 is a 2D ferromagnet, and FeTe is an antiferromagnetic metal.
Zi‐Jie Yan   +13 more
wiley   +1 more source

Advanced Techniques for Scalable Woven E‐Textiles Manufacturing

open access: yesAdvanced Materials Technologies, Volume 11, Issue 6, 18 March 2026.
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin   +2 more
wiley   +1 more source

A waterproof and ultra-elastic thermoelectric foam for underwater human signal detection. [PDF]

open access: yesNat Commun
Liu W   +12 more
europepmc   +1 more source

Programmable Dimensional Lithography with Digital Micromirror Devices for Multifunctional Microarchitectures

open access: yesAdvanced Materials Technologies, Volume 11, Issue 5, 6 March 2026.
This review explores recent advances in digital micromirror device (DMD)‐based lithography, focusing on its programmable light modulation, multi‐material compatibility, and dimensional patterning strategies. It highlights innovations from optical system design to materials integration and multifunctional applications, positioning DMD lithography as a ...
Yubin Lee   +5 more
wiley   +1 more source

Recyclable and Binder‐Free EGaIn–Carbon Liquid Metal Composite: A Sustainable Approach for High‐Performance Stretchable Electronics, Thermal‐Interfacing and EMI‐Shielding

open access: yesAdvanced Materials Technologies, Volume 11, Issue 6, 18 March 2026.
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini   +4 more
wiley   +1 more source

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