Results 171 to 180 of about 1,910,975 (300)

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

Advanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju, Rumana Hossain, Veena Sahajwalla   +2 more
wiley   +1 more source

Influence of cold plasma activation on fluoride uptake and demineralization of enamel. [PDF]

Clin Oral Investig
Schmidt A, Zingen L, Barke S, Rohland B, Harms M, Ortmann R, Viöl W, Wiegand A.   +7 more
europepmc   +1 more source

Moisture‐Adaptive Triboelectric Materials and Platforms: Design Strategies, Performance Enhancement, and Applications in Energy Harvesting and Wearable Electronics

Advanced Materials Technologies, EarlyView.
This review summarizes moisture‐adaptive strategies that enable triboelectric nanogenerators (TENGs) to operate across diverse moisture conditions. It examines moisture‐management methods, including exclusion, directional transport, removal, and utilization, with charge‐regulation approaches based on interfacial, dielectric, and structural engineering.
Junzhe Gan, Zhao Sha, Xuehua Zhang, Hoang‐Phuong Phan, Jin Zhang   +4 more
wiley   +1 more source

Gases, Plasmas, and Electric Discharge [PDF]

AIP Conference Proceedings, 2013
openaire   +1 more source

Conductive Tin Oxide Under the Thermal Budget of Perovskite/TOPCon Tandems: Toward Indium‐Free Contacts

Advanced Materials Technologies, EarlyView.
This work demonstrates that achieving conductive undoped SnOx contacts required careful tailoring of oxygen vacancy (VO) tuning and defect engineering. Controlling oxygen deposition pressure and low‐temperature annealing (300°C) optimizes defect stoichiometry and mitigates carrier scattering. This low thermal budget approach significantly enhances Hall
Paul Llontop, Mario Hanser, Matthew Wright, Soumyajit Maitra, Eloy J. Marcelis, Jana‐Isabelle Polzin, Martin Bivour, David C. Grinter, Pilar Ferrer, Iris C. G. van den Bosch, Christoph Baeumer, Ruy S. Bonilla, Armin Richter, Monica Morales‐Masis   +13 more
wiley   +1 more source

Plasma tool as green route for incorporation of flame retardancy and ultraviolet protection of textile fabrics. [PDF]

Sci Rep
Abdel-Razik AM, Nasr HE, Attia NF.
europepmc   +1 more source

Microwall‐Integrated Terahertz Metasurfaces for Spatially Guided Label‐Free Sensing of Micrometer‐Scale Plastic Particles

Advanced Materials Technologies, EarlyView.
A THz metasurface device integrating a metal–dielectric–metal resonator with microwall‐defined recessed regions enables spatially guided, label‐free sensing of micrometer‐scale plastic particles. The as‐fabricated devices exhibit distinct THz reflection resonances for 3.1‐µm polystyrene particles and a concentration‐dependent resonance‐frequency‐shift ...
Naoki Inomata, Yuki Sakai, Yoshiaki Kanamori   +2 more
wiley   +1 more source

Plasma-activated gas: a new dawn for wound care and infection. [PDF]

Med Gas Res
Li X, Zhong YS, Yuan MY, Xie ZL, Zhang XR, Zhang ZZ, Zhang JS, Ren DM, Liu DX, Hou MX, Liu YE.   +10 more
europepmc   +1 more source

Electric‐Field‐Assisted Spin Coating: A New Process for Adjusting Crystallization of Perovskite Thin Films

Advanced Materials Technologies, EarlyView.
Electric‐field‐assisted spin coating is introduced as a wet‐film processing route for guiding perovskite crystallization. A transient perpendicular field produces distinct structural maxima rather than monotonic grain growth: largest scanning electron microscopy (SEM)‐derived grain size at nominal 2 kV cm−1${\rm cm}^{-1}$, largest X‐ray diffraction ...
James R. Zelaya, Gary C. Tepper
wiley   +1 more source

Nitrogen fixation efficiency enhancement using plasma jet: Impact of grounded electrode. [PDF]

PLoS One
Arafat Y, Rahman M, Sheikh A, Talukder MR.   +3 more
europepmc   +1 more source