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Plans to introduce pilot lines for 300 mm processing are in progress. The IC technology is simultaneously moving towards 0.18 µm and 0.15 µm linewidths. The convergence of these two trends places unprecedented stringent demands on processes and equipments. The challenges faced by equipment manufacturers are enormous.
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Plans to introduce pilot lines for 300 mm processing are in progress. The IC technology is simultaneously moving towards 0.18 µm and 0.15 µm linewidths. The convergence of these two trends places unprecedented stringent demands on processes and equipments. The challenges faced by equipment manufacturers are enormous.
openaire +1 more source
Processing Plasmas and Reactors
1995In our discussion of the fundamental characteristics of plasmas, we did not place emphasis on the means of generating and sustaining the plasma. Nor did we consider the proper confinement of the plasma and the reactants, or the optimization of the plasma in order to produce a solid film on the substrate. In this chapter we will address these issues and
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CH4 dry reforming in fluidized-bed plasma reactor enabling enhanced plasma-catalyst coupling
Journal of CO2 Utilization, 2021Tomohiro Nozaki +2 more
exaly
Ignition of CO2 methanation using DBD-plasma catalysis in an adiabatic reactor
Chemical Engineering Journal, 2022M Biset-Peiró, TERESA Andreu
exaly