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Electrocrystallization: A Synthetic Method for Intermetallic Phases with Polar Metal–Metal Bonding

Inorganic Chemistry, 2016
Isothermal electrolysis is a convenient preparation technique for a large number of intermetallic phases. A solution of the salt of a less-noble metal is electrolyzed on a cathode consisting of a liquid metal or intermetallic system. This yields crystalline products at mild reaction conditions in a few hours.
Frank, Tambornino   +6 more
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Novel Polar Intermetallic π-Systems along the Zintl Border

MRS Proceedings, 1998
AbstractStudies have shown that complex Zintl phases exhibit a rich diversity of crystal structures. These have also revealed a remarkable success of the Zintl concept in rationalizing stoichiometry, crystal structure and chemical bonding of many main group intermetallics.
Arnold M. Guloy, Zhihong Xu
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Effect of the Polarity of the III-V Intermetallic Compounds on Etching

Journal of Applied Physics, 1960
For the III-V intermetallic compounds, the <111> directions are polar axes. The shape of etch pits bounded by crystallographic planes and the presence or absence of pits at dislocations are influenced by the effect of the polar axes on the etch rates.
J. W. Faust, A. Sagar
openaire   +1 more source

Conduction electron spin polarization in some intermetallic europium compounds

Physica B+C, 1977
Abstract For the CaCu 5 -type compounds EuX 5 (X = Cu, Zn, Ag, Au) the magnetic properties, the lattice constants, the 151 Eu hyperfine fields and the isomer shifts were determined. The transferred hyperfine fields were estimated by means of data obtained on some pseudobinaries Eu 1− x R x X 5 (R = Ca, La, Gd).
F.J. van Steenwijk   +4 more
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β-Li2Zn5: A Low Symmetric Polar Intermetallic Compound

Inorganic Chemistry, 2019
The crystal structure of the high-temperature modification of the compound Li2Zn5 was determined using single-crystal X-ray diffraction data. It is the first representative of a new binary structure type with triclinic space group P1̅, where the parameters of the unit cell are a = 8.0073(3)Å, b = 11.5956(6)Å, c = 15.2956(5)Å, α = 96.39°, β = 101.92 ...
Igor Oshchapovsky   +2 more
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Ba5Ti12Sb19+x, a polar intermetallic compound with a stuffed γ-brass structure

Journal of Solid State Chemistry, 2009
Abstract The polar intermetallic compound Ba5Ti12Sb19+x (x⩽0.2) has been synthesized by reaction of the elements. Single-crystal X-ray diffraction analysis revealed that it adopts a new structure type (Ba5Ti12Sb19.102(6), space group P 4 3 ¯ m , Z=2, a=12.4223(11) A, V=1916.9(3) A3).
Haiying Bie, Arthur Mar
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Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

Acta Materialia, 2009
Abstract The polarity effect of electromigration on the interfacial reactions of micro ball grid array (μBGA) solder joints was studied in terms of microstructural evolution. A dummy μBGA package with the same pair of solder joints was used to obtain reproducible results for a practical application.
Yu-Dong Lu   +4 more
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Probing magnetism of alloys and intermetallic compounds by spin polarized photoemission (invited)

Journal of Applied Physics, 1982
The potential of spin polarized photoemission for studies of alloys and intermetallic compounds is described, specifically with respect to its surface sensitivity. We present studies on well defined Ni1−xFex (100) surfaces for x = 0.2 and 0.6. We find that the majority spin band in the bulk is not full for x = 0.6.
M. Landolt   +4 more
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Local orbital and quadrupolar polarization of conduction electrons in ferromagnetic rare-earth intermetallics

Journal of Magnetism and Magnetic Materials, 1986
Abstract From a detailed analysis of the self-polarization field obtained from NMR experiments on several rare-earth nuclei in the RAl2 series, we obtain reasonable estimations of the local orbital, spin and quadrupolar polarization of 5d conduction electrons: 〈lz〉d⩽0.06, 〈sz〉d⩽0.09, 〈lz2-2〉d⩽0.05.
Y. Berthier, E. Belorizky
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Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

Journal of Materials Science: Materials in Electronics, 2017
In situ observation of electromigration (EM) has been carried out on cross-sectioned copper/tin–copper/copper (Cu/Sn0.7Cu/Cu) line-type interconnects. The surface vertical variation after EM is measured by step profiler, which indicates serious mass migration during EM. The EM rate is calculated using two distinct methods, in situ mark movement and the
Ze Zhu   +3 more
openaire   +1 more source

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