Results 251 to 260 of about 78,838 (289)
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Journal of Polymer Science Part C: Polymer Symposia, 1967
AbstractThe preparation and properties of aliphatic and aromatic polyimides are reviewed. The discussion includes a comparison of methods of synthesis of the aliphatic vs. aromatic polymers and a detailed consideration of chemical structure vs. properties.
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AbstractThe preparation and properties of aliphatic and aromatic polyimides are reviewed. The discussion includes a comparison of methods of synthesis of the aliphatic vs. aromatic polymers and a detailed consideration of chemical structure vs. properties.
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MRS Proceedings, 1996
AbstractWe have explored polyimide foams created using a block copolymer approach as part of our research efforts to obtain thin film dielectric layers with very low dielectric constants for use in microelectronic devices. In these systems the pore sizes are in the nanometer range thus the term “nanofoam”, The polyimide foams are prepared from phase ...
K. R. Carter +5 more
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AbstractWe have explored polyimide foams created using a block copolymer approach as part of our research efforts to obtain thin film dielectric layers with very low dielectric constants for use in microelectronic devices. In these systems the pore sizes are in the nanometer range thus the term “nanofoam”, The polyimide foams are prepared from phase ...
K. R. Carter +5 more
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Polymer International, 2020
Abstract Polyimide microspheres were prepared via non‐aqueous emulsion polymerization by using pyromellitic dianhydride (PMDA) as anhydride monomer and 2,2‐bis(4‐(4‐aminophenoxy)phenyl)propane as amine monomer. The polyimide microspheres were well characterized by Fourier transform infrared spectroscopy, SEM and laser particle size ...
Guorong Qiu, Wenshi Ma, Li Wu
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Abstract Polyimide microspheres were prepared via non‐aqueous emulsion polymerization by using pyromellitic dianhydride (PMDA) as anhydride monomer and 2,2‐bis(4‐(4‐aminophenoxy)phenyl)propane as amine monomer. The polyimide microspheres were well characterized by Fourier transform infrared spectroscopy, SEM and laser particle size ...
Guorong Qiu, Wenshi Ma, Li Wu
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Adhesion of polyimide to silicon and polyimide
Journal of Applied Polymer Science, 1993AbstractThe characteristics of the adhesions of polyimide to silicon and to polyimide and the autohesion of a polyimide blend have been investigated. As found, the peel strength of pyromellitic dianhydride–4,4′‐oxydianiline (PMDA–ODA) on silicon can be greatly improved by blending with 20 or 40% benzophenone tetracarboxylic dianhydride–p‐phenylene ...
Jwo‐Huei Jou +3 more
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Low temperature polyimide-to-polyimide direct bonding
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019In this study, two polyimide (PI) films were bonded at 250/300 °C for 60 min. A good bonding interface with few voids was observed. During the bonding process, the partial cured PI film still underwent cross-linking reaction, resulting the voids in bonding sample..
Hong-Che Liu, Chih Chen
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LC‐polyimides, 32. Characterization of the Mitsui‐Toatsu LC‐polyimide and related polyimides
Macromolecular Chemistry and Physics, 1997AbstractTwo polyimides were prepared from 1,3‐bis[4′‐(4″‐aminophenoxy)cumyl]benzene and 1,2:4,5‐benzenetetracarboxylic dianhydride (PMDA) or 1,8:4,5‐naphthalenetetracarboxylic dianhydride. A poly(amide‐imide) was prepared from the same diamine and trimellitic anhydride.
Gert Schwarz +5 more
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Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere
Polymer Engineering & ScienceAbstractA low dielectric polyimide/polyimide microsphere (PI/PM) composite film was constructed by thermal imidization of polyamic acid from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA) in the presence of porous PM. The PM particles with particle size of about 2 μm were prepared via the solvothermal method using 3,3′,4,4 ...
Ke Li +5 more
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The invention relates to a polyimide substantially built up from monomeric units of 3,3',4,4'-benzophenonetetracarboxylic dianhydride and monomeric units of a primary aliphatic diamine. The polyimide according to the invention is characterized in that the primary aliphatic diamine is substantially 1,4-diaminobutane.
Teuwen, L., Meijer, E.W., Koning, C.E.
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Teuwen, L., Meijer, E.W., Koning, C.E.
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