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Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere
Polymer Engineering & ScienceAbstractA low dielectric polyimide/polyimide microsphere (PI/PM) composite film was constructed by thermal imidization of polyamic acid from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA) in the presence of porous PM. The PM particles with particle size of about 2 μm were prepared via the solvothermal method using 3,3′,4,4 ...
Ke Li +5 more
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The invention relates to a polyimide substantially built up from monomeric units of 3,3',4,4'-benzophenonetetracarboxylic dianhydride and monomeric units of a primary aliphatic diamine. The polyimide according to the invention is characterized in that the primary aliphatic diamine is substantially 1,4-diaminobutane.
Teuwen, L., Meijer, E.W., Koning, C.E.
openaire
Teuwen, L., Meijer, E.W., Koning, C.E.
openaire
Vapor Deposition of Polyimide and Polyimide Precursors on Copper
1989Lamb, R. +4 more
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Flexible Organic Solar Cells Over 15% Efficiency with Polyimide-Integrated Graphene Electrodes
Joule, 2020Sungwoo Jung +2 more
exaly
Heterogeneous silica-polyimide aerogel-in-aerogel nanocomposites
Chemical Engineering Journal, 2022Matthias M Koebel +2 more
exaly