Results 251 to 260 of about 38,523 (307)
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The hydrolysis of polyimides

Experientia, 1973
Thermal polymerization of aspartic acid produces a polysuccinimide (I), a chain of aspartoyl residues. An investigation was made of the alkaline hydrolysis of the imide rings of (I) which converts the polyimide to a polypeptide. The alkaline hydrolysis of polyimides can be expected to be kinetically complex due to increasing negative charge generated ...
P D, Hoagland, S W, Fox
openaire   +2 more sources

Adhesion of polyimide to silicon and polyimide

Journal of Applied Polymer Science, 1993
AbstractThe characteristics of the adhesions of polyimide to silicon and to polyimide and the autohesion of a polyimide blend have been investigated. As found, the peel strength of pyromellitic dianhydride–4,4′‐oxydianiline (PMDA–ODA) on silicon can be greatly improved by blending with 20 or 40% benzophenone tetracarboxylic dianhydride–p‐phenylene ...
Jwo‐Huei Jou   +3 more
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Polyimides

Journal of Polymer Science Part C: Polymer Symposia, 1967
AbstractThe preparation and properties of aliphatic and aromatic polyimides are reviewed. The discussion includes a comparison of methods of synthesis of the aliphatic vs. aromatic polymers and a detailed consideration of chemical structure vs. properties.
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LC‐polyimides, 32. Characterization of the Mitsui‐Toatsu LC‐polyimide and related polyimides

Macromolecular Chemistry and Physics, 1997
AbstractTwo polyimides were prepared from 1,3‐bis[4′‐(4″‐aminophenoxy)cumyl]benzene and 1,2:4,5‐benzenetetracarboxylic dianhydride (PMDA) or 1,8:4,5‐naphthalenetetracarboxylic dianhydride. A poly(amide‐imide) was prepared from the same diamine and trimellitic anhydride.
Gert Schwarz   +5 more
openaire   +1 more source

Surface Modification of Polyimide Fibers and The Bending Property of Polyimide Fiber/Polyimide Composite

Proceedings of the 12th International Conference on Biomedical Engineering and Technology, 2022
Xuenan Sun   +3 more
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Low temperature polyimide-to-polyimide direct bonding

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019
In this study, two polyimide (PI) films were bonded at 250/300 °C for 60 min. A good bonding interface with few voids was observed. During the bonding process, the partial cured PI film still underwent cross-linking reaction, resulting the voids in bonding sample..
Hong-Che Liu, Chih Chen
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Biocompatibility of fluorinated polyimide

Journal of Biomedical Materials Research, 2002
AbstractContact between blood and biomaterial triggers a complex series of events including protein adsorption, leukocyte adhesion and activation, and complement activation. In this article, a series of fluorinated polyimides cured at a different temperatures was prepared, and the biocompatibility of the membranes was evaluated using in vitro protein ...
M, Kanno   +3 more
openaire   +2 more sources

High-Resolution Profiling of the Polyimide−Polyimide Interface

Macromolecules, 1996
Dynamic secondary ion mass spectrometry (SIMS), nuclear reaction analysis, and neutron reflectometry were used to profile polyimide−polyimide interfaces. For interfaces between two layers of poly(4,4‘-oxydiphenylene−pyromellitimide) (PMDA−ODA) polyimide it was determined that the interfacial fracture energy Gc and the interfacial width depended ...
Nancy C. Stoffel   +7 more
openaire   +1 more source

Nanoporous Polyimide Films from Polyimide-Aliphatic Polyester or Polyimide-Aliphatic Polycarbonate Copolymers

MRS Proceedings, 1996
AbstractWe have explored polyimide foams created using a block copolymer approach as part of our research efforts to obtain thin film dielectric layers with very low dielectric constants for use in microelectronic devices. In these systems the pore sizes are in the nanometer range thus the term “nanofoam”, The polyimide foams are prepared from phase ...
K. R. Carter   +5 more
openaire   +1 more source

Vapor Deposition of Polyimide and Polyimide Precursors on Copper

1990
Abstract : In this article we describe experiments in which ultra-thin films of polyimide were formed on polycrystalline and (111) single crystal copper substrates following heating of a vapor deposited layer of polyamic acid produced by codeposition of 4,4'-diaminodiphenyl ether (ODA) and 1,2,4,5- benzenetetracarboxylic dianhydride (PMDA).
W. N. Unertl   +4 more
openaire   +1 more source

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