Results 141 to 150 of about 4,857,649 (284)

Impact of Morphological and Structural Properties of Submicron Core-Shell Fe-Silica Particles on High-Current Power Converter Performance in Electronics. [PDF]

ACS Omega
Ratnasari D, Septiani EL, Nandiyanto ABD, Cao KLA, Hirano T, Okuda N, Matsumoto H, Ogi T.   +7 more
europepmc   +1 more source

DigiChrom: A Domain Ontology for Semantic Representation of Trivalent Chromium Platings and Its Large Language Model‐Based Alignment With Multiple Mid‐Level Ontologies

Advanced Engineering Materials, EarlyView.
Digitalizing electroplating requires both domain knowledge and interoperability. This work introduces PlatOn, a domain ontology for trivalent chromium plating and coating characterization, and a hybrid pipeline that aligns it to a mid‐level reference ontology by combining eight similarity metrics with language model reasoning. Expert‐validated mappings
Janik Harter, Elena Garcia Trelles, Christoph Schweizer, Thomas Seifert, Christoph Baumer, Mahmoud Elkady, Katja Feige, Daniel Grimme, Edgar Hoffmann, Andreas Waibel, Anke Walter   +10 more
wiley   +1 more source

Artificial intelligence for cybersecurity monitoring of cyber-physical power electronic converters: a DC/DC power converter case study. [PDF]

Sci Rep
Habibi MR, Guerrero JM, Vasquez JC.
europepmc   +1 more source

Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials

Advanced Engineering Materials, EarlyView.
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley   +1 more source

Implementation of high step-up power converter for fuel cell application with hybrid MPPT controller. [PDF]

Sci Rep
Prashanth V, Rafikiran S, Hussaian Basha CH, Kumar JA, Dhanamjayulu C, Kotb H, ELrashidi A.   +6 more
europepmc   +1 more source

Discrepancies Between Micro Versus Macroscale Viscoelastic Properties in a Microplastic‐Tissue Composite Model

Advanced Engineering Materials, EarlyView.
This study explores the discrepancies between bulk mechanics and spatial mapping in a tissue‐mimetic hydrogel model. Microplastic particles create localized stiff mechanical microenvironments that are detectable by cellular‐scale nanoindentation but leave bulk properties unchanged as measured by rheology.
Ahron T. Verschleisser, Baptiste Le Roi, Omri Leshem, Joshua M. Grolman   +3 more
wiley   +1 more source

Controlling Grain Growth in Powder Bed Fusion of Yttria‐Stabilized Zirconia Using Femtosecond Lasers: Challenges and Methodological Insights

Advanced Engineering Materials, EarlyView.
Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn, Sarah Kaden, Andrea Barz, Daniel Störzner, Jens Bliedtner, Andrés Fabián Lasagni   +5 more
wiley   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

Advanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan, Jiafen Song, Jinglong Li, Jiangtao Xiong, Tao Yang   +4 more
wiley   +1 more source