Results 231 to 240 of about 254,560 (354)
Defect detection of printed circuit board assembly based on YOLOv5. [PDF]
Shen M +10 more
europepmc +1 more source
Schematic illustration of the electrically assisted thermal stamping (EATS) method for direct fabrication of carbon‐based nanofilms and their multifunctional applications. Localized Joule heating triggers simultaneous exfoliation, reduction, and fluoropolymer incorporation under ambient conditions, yielding tunable carbon‐based thin‐film coatings ...
Byungseok Seo +9 more
wiley +1 more source
YOLO-BFRV: An Efficient Model for Detecting Printed Circuit Board Defects. [PDF]
Liu J, Kang B, Liu C, Peng X, Bai Y.
europepmc +1 more source
Stimuli‐Responsive Afterglow from Luminescent Liquid Crystal Elastomers
An active glow luminescent system for encoding, signaling, and tracking in dark environments has been developed by integrating inorganic ultralong afterglow phosphors with adaptive liquid crystal elastomer actuators. Abstract Stimuli‐responsive luminescent polymeric materials which combine afterglow emission with mechanical flexibility and adaptability
Lansong Yue +2 more
wiley +1 more source
Organic Synaptic Transistors and Printed Circuit Board Defect Inspection with Photonic Stimulation: A Novel Approach Using Oblique Angle Deposition. [PDF]
Lee G +6 more
europepmc +1 more source
Rate-limiting factors for indirect two-step biodismantling for printed circuit board recycling
Benjamin Monneron-Enaud +3 more
openalex +1 more source
A Simple, One-step, Seedless Hydrothermal Growth of ZnO Nanorods on Printed Circuit Board Substrate
Mai Hong Hanh +3 more
openalex +2 more sources
Coupling a dual‐gradient carbonized framework with Fe2O3/Fe‐N‐C catalytic sites enables spatially synchronized sulfur redox across the entire electrode thickness in high‐mass‐loading Li–S batteries. This synergistic structural–catalytic design effectively mitigates concentration, ohmic, and electrochemical polarization, thereby achieving high‐capacity ...
Yuxuan Zhang +6 more
wiley +1 more source
A modeling method for thermal steady-state simulation of the four-layer printed circuit board. [PDF]
Zhang Y, Chen L.
europepmc +1 more source

