Results 231 to 240 of about 22,531,219 (286)

Controlling Grain Growth in Powder Bed Fusion of Yttria‐Stabilized Zirconia Using Femtosecond Lasers: Challenges and Methodological Insights

open access: yesAdvanced Engineering Materials, EarlyView.
Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn   +5 more
wiley   +1 more source

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

open access: yesAdvanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz   +4 more
wiley   +1 more source

Leveraging Symbolic Artificial Intelligence and Fuzzy Logic for Materials Science: A Review of Methods, Challenges, and Applications to Scarce and Imperfect Experimental Data

open access: yesAdvanced Engineering Materials, EarlyView.
This article explores the transformative potential of symbolic artificial intelligence (AI) in the field of materials science, particularly in leveraging experimental data. The article presents several symbolic AI models and discusses their applications in materials science.
Ahmed Amrani   +7 more
wiley   +1 more source

Probabilistic Computing via Gate-Tunable Random Telegraph Noise. [PDF]

open access: yesAdv Sci (Weinh)
Yun G   +8 more
europepmc   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

Probabilistic analysis

open access: yes, 1985
R.M. Karp   +3 more
openaire   +1 more source

Three-Dimensional Identification of the Frontal Aslant Tract in the Human Brain: Tractography Study. [PDF]

open access: yesBrain Sci
Kierońska-Siwak S   +7 more
europepmc   +1 more source

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