Results 1 to 10 of about 8,152,883 (248)
Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition
The pulse reverse current electrodeposition process consists of two stages: the forward deposition and reverse dissolution. This study aims to understand the characteristics of forward deposition and reverse dissolution and to reveal their influences on ...
Yanzhuo Dong +5 more
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This work focuses on the influence of pulse reverse current parameters such as duty cycle and frequency on the microstructure and properties of graphene reinforced copper nanocomposite (Cu-Gr) coating.
Antony Joseph +5 more
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The metallic layers are an essential part of MEMS (micro electromechanical system) devices, and their deposition process must be accurately controlled; this may lead to difficulties as there are many input parameters for such a process.
Reza Ahmadian Koochaksaraie +2 more
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Memristive Hodgkin-Huxley Spiking Neuron Model for Reproducing Neuron Behaviors
The Hodgkin-Huxley (HH) spiking neuron model reproduces the dynamic characteristics of the neuron by mimicking the action potential, ionic channels, and spiking behaviors. The memristor is a nonlinear device with variable resistance.
Xiaoyan Fang +8 more
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Introduction. A semiconductor diode based on reverse current interruption is used to increase a pulse amplitude and peak power delivered on the process load.
O. I. Khrysto
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Pulsed spark-assisted chemical engraving (SACE) is a promising technology for micromachining of insulating materials, with no burrs, no cracks and no residues left after processing. Cathode tool wear, however, is one of the problems that must be overcome
Shunda Zhan, Yonghua Zhao
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Electrodeposition and analysis of thick bismuth films
Due to its unique physical and chemical properties, bismuth is an attractive candidate for a wide range of applications such as battery anodes, radiation shielding, and semiconductors, to name a few.
Kendrich O. Hatfield +7 more
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In this paper, a Ni/NiO composite coating has been prepared by the pulse reverse current (PRC) plating technique and the effects of parameters including average current density, pulse frequency, total duty cycle, forward duty cycle, plating temperatures ...
Ping Wang +4 more
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Improving parameters of planar pulse diode using gettering
Pulse diodes are widely used as part of high-frequency pulse circuits. However, it should be noted that the cost of pulsed diodes remains relatively high, due to the low yield of suitable devices when they are sorted according to the criteria of reverse ...
Viktor Litvinenko +3 more
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This work aims to provide information about the deposition of gold via bipolar high-power impulse magnetron sputtering (HIPIMS) in order to identify suitable process parameters.
Jürgen Guljakow, Walter Lang
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