Results 231 to 240 of about 726,846 (313)

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Highly Stable Low‐Temperature Phosphate Glass as a Platform for Multimaterial 3D Printing of Integrated Functional Microfluidic Devices

open access: yesAdvanced Engineering Materials, EarlyView.
A highly stable, low‐temperature phosphate glass is developed for multimaterial additive manufacturing of multifunctional microfluidics. Glass, metal conductors, and sacrificial polymer are coprinted, enabling monolithic fabrication. The sacrificial paste forms precise channels and decomposes during sintering.
Babak Mazinani   +2 more
wiley   +1 more source

Poly(1,4‐anthraquinone) as an Organic Electrode Material: Interplay of the Electronic and Structural Properties due to the Unusual Lone‐Pair‐π Conjugation

open access: yesAdvanced Functional Materials, Volume 35, Issue 12, March 18, 2025.
In this study, the unique role of the unusual lone‐pair‐π conjugation mechanism in poly(1,4‐anthraquinone) (P14AQ) is explored as an organic electrode material. Unlike traditional π‐π interactions, P14AQ's conjugation involves lone pairs of oxygen atoms interacting with the π cloud of adjacent units, enabling stable charge transport even with minimal π‐
Xiaotong Zhang, Piotr de Silva
wiley   +1 more source

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