Results 181 to 190 of about 85,788 (333)

3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby, Xiaomei Yan, Timon Huber, Aaron Schneider, Gilberto Siqueira, Gustav Nyström   +5 more
wiley   +1 more source

Comparative study of the structural parameters of reaction-sintered ceramics based on silicon carbide using digital materials science methods

М. А. Марков, A. G. Chekuryaev, A. N. Belyakov, А. Н. Николаев, D. A. Dyuskina, А. Д. Быкова, М. М. Сычев   +6 more
openalex   +1 more source

Material Design for High Strength and Toughness of Continuous SiC Fiber-Reinforced Reaction Sintered SiC Matrix Composite.

, 2001
Yoshiyasu Itoh, Shoko Suyama, Tsuneji Kameda   +2 more
openalex   +2 more sources

Mucosa‐Interfacing Capsule for In Situ Sensing the Elasticity of Biological Tissues

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A fundamental mechanism of palpating soft materials is reported to sense deep tissue elasticity in situ with minimal invasion using the interaction between the robot palpation unit and soft tissues. Both the robot locomotion and elasticity sensing functions are remotely controlled by external magnetic fields, while the sensing data are wirelessly ...
Kiyoung Kim, Steven Edwards, Kyle Fuxa, Honglu Lin, Shreya Shrestha, Hanwen Fan, Nick Diaz, Joel Berinstein, Rishi Naik, Yuxiao Zhou, Xiaoguang Dong   +10 more
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Enhanced sinterability and mechanical strength of beta-type tricalcium phosphates ceramics through reaction sintering with hydroxyapatite

Kazuaki Hashimoto, Masashi Baba, Hirobumi Shibata, Katsumi Yoshida   +3 more
openalex   +1 more source

The development of low-temperature sintering techniques for functional ceramic devices using chemical reactions

, 2020
Yuki Yamaguchi
openalex   +2 more sources

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

Advanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya, Farid Akhtar, Konda Gokuldoss Prashanth   +2 more
wiley   +1 more source

Preparation of Highly Active Mg-Al-Li-B Alloys via High-Temperature Sintering. [PDF]

Materials (Basel)
Wang Y, Xu H, Zhuang Z, He J, Peng W, Zhang X, Chen H, Zhou L.   +7 more
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source