Results 121 to 130 of about 156,728 (358)

Single-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon

Proceedings, 2017
This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be ...
Marta Kluba, Aslihan Arslan, Ronald Stoute, James Muganda, Ronald Dekker   +4 more
doaj   +1 more source

UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability. [PDF]

Nanomaterials (Basel), 2023
Dirdal CA, Milenko K, Summanwar A, Dullo FT, Thrane PCV, Rasoga O, Avram AM, Dinescu A, Baracu AM.   +8 more
europepmc   +1 more source

Gallium arsenide and aluminum gallium arsenide reactive ion etching in boron trichloride/argon mixtures [PDF]

, 1987
Axel Scherer, H. G. Craighead, E. D. Beebe   +2 more
openalex   +1 more source

Interfacial Interaction‐Mediated Regulation of Metal Oxidation States for Enhanced CO2 Reduction

Advanced Functional Materials, EarlyView.
A hybrid strategy is employed to optimize bismuth–oxygen interactions, precisely regulating interfacial bismuth–oxygen bonds during topochemical synthesis. This leads to vanadium oxynitride‐bismuth catalyst exhibiting high Faradaic efficiency and durability for formate production, attributed to enhanced reaction thermodynamics and kinetics.
Zhongyuan Ma, Cheng Lin, Hyug Hee Han, Youn‐Sang Bae, Kug‐Seung Lee, Kan Zhang, Jong Hyeok Park   +6 more
wiley   +1 more source

Unraveling the Mechanism of Maskless Nanopatterning of Black Silicon by CF₄/H₂ Plasma Reactive-Ion Etching. [PDF]

ACS Omega, 2022
Ghezzi F, Pedroni M, Kovač J, Causa F, Cremona A, Anderle M, Caniello R, Pietralunga SM, Vassallo E.   +8 more
europepmc   +1 more source

Plasma Nanoscience: from Nano-Solids in Plasmas to Nano-Plasmas in Solids

, 2013
The unique plasma-specific features and physical phenomena in the organization of nanoscale solid-state systems in a broad range of elemental composition, structure, and dimensionality are critically reviewed.
Meyyappan, M., Neyts, E. C., Ostrikov, K.   +2 more
core   +2 more sources

Effects of reactive ion etching on chemical vapor deposition [PDF]

, 1987
C. Y. Wong, Philip E. Batson
openalex   +1 more source

Dynamic Networks via Polymerizable Deep Eutectic Monomers for Uniform Li+ Transport at Interfaces in Lithium Metal Batteries

Advanced Functional Materials, EarlyView.
The PDEM‐based SIGPE provides a dynamic nanophase from Li+‐bridged molecular self‐association, enhancing electrochemical stability and facilitating uniform Li+ ion flux at the interface. This unique solvation structure results in a hetero species‐driven inorganic‐rich SEI and long‐term cycle stability, suggesting that a PFAS‐free Li+‐containing monomer
Susung Yun, Seonho Kim, Puji Lestari Handayani, Sungyeb Jung, Jae Hyun Park, U Hyeok Choi   +5 more
wiley   +1 more source

InP nanocrystals on silicon for optoelectronic applications

, 2012
One of the solutions enabling performance progress, which can overcome the downsizing limit in silicon technology, is the integration of different functional optoelectronic devices within a single chip. Silicon with its indirect band gap has poor optical
Helm, Manfred, Liedke, Maciej Oskar, Mücklich, Arndt, Ou, Xin, Prucnal, Slawomir, Pyszniak, Krzysztof, Reuther, Helfried, Skorupa, Wolfgang, Turek, Marcin, Zhou, Shengqiang, Zuk, Jerzy   +10 more
core   +1 more source

Comment on ‘‘Low-temperature reactive ion etching and microwave plasma etching of silicon’’ [Appl. Phys. Lett. 5 2, 616 (1988)] [PDF]

, 1988
Jacques Pelletier
openalex   +1 more source