Results 31 to 40 of about 15,261 (222)
Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength [PDF]
The focus of this study is on the effect of reflow parameters on the joint shear strength. Eight reflow profiles were developed using four factors at two levels of Taguchi design of experiment for 1206, 0805 and 0603 chip resistors.
Bernasko, Peter K. +3 more
core +1 more source
Background: Stress hyperglycemia is a common finding during acute myocardial infarction and associated with poor prognosis. To reduce the occurrence of no-reflow, prognostic factors must be identified before primary percutaneous coronary intervention ...
Mohamed Khalfallah +2 more
doaj +1 more source
Background: The no-/slow-reflow phenomenon following primary percutaneous coronary intervention (PCI) in patients with ST-elevation myocardial infarction (STEMI)is associated with poor prognosis.
Enmin Xie +8 more
doaj +1 more source
Objectives. To evaluate the predictive value of target lesion SYNTAX score (TL-SS) for no-reflow in the patients with acute myocardial infarction undergoing urgent percutaneous coronary intervention (PCI). Background.
Guofeng Gao +7 more
doaj +1 more source
Introduction: No reflow phenomenon following primary percutaneous coronary intervention (PCI) is a strong predictor of mortality. Platelet/lymphocyte ratio (PLR) is an indicator of long-term outcome in ischemic heart disease patients.
Ahmed Mohamed El Missiri +2 more
doaj +1 more source
REFLOW Collaborative Governance Toolkit (RCGT) v 1.0
This report presents the REFLOW Collaborative Governance Toolkit v 1.0. In its second iteration, the Toolkit is designed as a website hosted in the REFLOW web domain (www.reflowproject.eu) and featured as a sub-page within the REFLOW website (https ...
Munoz Unceta, Pablo +5 more
core +1 more source
Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process
The strategies for inducing heredity of β-Sn texture and thus controlling β-Sn orientation in micro solder joints during multi-reflow process were investigated.
Yuanyuan Qiao +3 more
doaj +1 more source
A rework of electronic assemblies and the reuse of electronic components are the most effective ways to reduce electronic waste. Since neither components nor substrates were developed with the intention of multiple usage, the question of how the ...
Erik Wiss, Steffen Wiese
doaj +1 more source
Objective: No-reflow is a phenomenon that can arise due to factors such as distal embolization, microvascular occlusion, or prolonged myocardial ischemia and damage.
Çağrı Zorlu, Cemal Köseoğlu
doaj +1 more source
Background: No-reflow is an important factor as it predicts a poor outcome in patients undergoing primary angioplasty. In comparison with patients attaining TIMI 3 flow, patients with no-reflow have an increased incidence of ventricular arrhythmias ...
Ali Mohammed Kareem Al-Jabari +2 more
doaj +1 more source

