Results 111 to 120 of about 8,382,253 (346)
El terrorismo como amenaza para la seguridad
Comillas Journal of International Relations
doaj
Phase‐Change Solvents for Thermally Switchable Ion Conduction in Organogels
Organogels containing salts dissolved in phase‐change solvents exhibit thermally switchable ion conduction. The organogels, which display an over 10 000‐fold on‐off ratio and high cycling stability, can be synthesized with a wide range of salts and customizable conductivity/temperature relations for applications in ionotronics and energy storage ...
Yi‐ming Yuan, Thomas B. H. Schroeder
wiley +1 more source
Atomically Resolved Acoustic Dynamics Coupled with Magnetic Order in a Van der Waals Antiferromagnet
Magnetically coupled acoustic phonon modes (f1, f2, f3) are captured by ultrafast X‐ray diffraction in a prototypical van der Waals antiferromagnet FePS3, including their atomic displacement vectors (u) and the acoustic propagation wave vectors (k). Notably, the atomic displacement vector and amplitude of these modes, represented by the direction and ...
Faran Zhou +24 more
wiley +1 more source
SAA significantly enhanced Al/PU bonding, increasing SLSS by up to 920% and fracture energy by 15 100% through optimized micro‐nano porous surfaces. RSM identified the optimal anodizing conditions, while ML confirmed sulfuric acid concentration and roughness as dominant predictors of strength.
Umut Bakhbergen +6 more
wiley +1 more source
Relations between the statistics of natural images and the response properties of cortical cells.
D. Field
semanticscholar +1 more source
Aqueous directional ice templating (DIT) is developed for making NMC811 cathodes containing vertically aligned pore arrays through electrode thickness. The effects of calendering are studied for the DIT electrodes to find optimal calendering and simultaneously achieve high gravimetric and volumetric energy densities and rate capability for lithium ion ...
Guanting Li +3 more
wiley +1 more source
COVID-19. Pandemia y crisis global
Comillas Journal of International Relations
doaj
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source

