Ultrasensitive detection of carbendazim pesticide in tea leaves using a green Ag/CuO(Cu<sub>2</sub>O) nanocomposite-based SERS sensor: role of metal/semiconductor transition in sensing performance. [PDF]
RSC AdvThi Linh D +5 more
europepmc +1 more source
through fluorine chemistry...new dimensions in electronics: HOW HF IMPROVES SEMICONDUCTOR RELIABILITY [PDF]
, 1963 openalex +1 more source
Ice Lithography: Recent Progress Opens a New Frontier of Opportunities
Advanced Functional Materials, EarlyView.This review focuses on recent advancements in ice lithography, including breakthroughs in compatible precursors and substrates, processes and applications, hardware, and digital methods. Moreover, it offers a roadmap to uncover innovation opportunities for ice lithography in fields such as biological, nanoengineering and microsystems, biophysics and ...
Bingdong Chang +9 more
wiley +1 more source
Impact of proton-beam irradiation on the electrical reliability and performance of LTPS and a-IGZO thin-film transistors. [PDF]
Sci RepNoh J +8 more
europepmc +1 more source
Advanced Functional Materials, EarlyView.A UV‐crosslinkable soft anisotropic conductive film (ACF) provides high‐resolution, room‐temperature electrical interfacing. Upon UV exposure, azide crosslinkers within the ACF matrix form covalent bonds with a wide range of C–H‐containing materials, resulting in interfaces that are both mechanically durable and electrically reliable.
Jun Choi +7 more
wiley +1 more source
<i>In Situ</i> Atomic-Scale Investigation of Electromigration Behavior in Cu-Cu Joints at High Current Density. [PDF]
ACS NanoHuang HJ +9 more
europepmc +1 more source
Strain‐Activated Photo‐Dehalogenation Unlocks Low‐Energy One and Two‐Photon 3D Microfabrication
Advanced Functional Materials, EarlyView.5,14‐NMI‐Cz acts, conversely to its 7,10‐NMI‐Cz(7,10‐'dibromo‐2‐(2,6‐diisopropylphenyl)‐1H‐benzo[lmn]carbazolo[9,1‐bc][2,8]phenanthroline‐1,3(2H)‐dione) counterpart, as modular photoinitiator with panchromatic photoactivity, featuring a weak C–Br bond from geometric strain for efficient Type I & II initiation. These studies demonstrate applicability of
Kacper Piskorz +10 more
wiley +1 more source
Interface Thermal Resistance in Heterostructures of Micro-Nano Power Devices: Current Status and Future Challenges. [PDF]
Nanomaterials (Basel)Shen Y +5 more
europepmc +1 more source