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Reliability of compound semiconductor devices
Microelectronics Reliability, 1992Abstract This paper reviews the reliability of III–V semiconductor devices with particular attention to the failure mechanisms typical of these structures. Instability effects at the surface of various FETs have been examined and the problems related to the metallurgies employed.
FANTINI, Fausto, F. MAGISTRALI
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Semiconductor laser reliability
SPIE Proceedings, 1998In this paper, a review of the state-of-the-art in semiconductor laser diode reliability is presented, with a particular regard to the reliability of laser diodes used in long-distance telecommunication system. Remarkable advances in semiconductor laser reliability have been demonstrated over their thirty year history, leading to estimated median ...
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A reliability appraisal of semiconductor devices
Proceedings of the IEE - Part B: Electronic and Communication Engineering, 1959The current problems of assessing the reliability of semiconductor devices are discussed, and reference is made to the order of reliability required in typical applications.The evidence from life tests carried out on devices drawn from production lines of transistors and diodes shows how variations in operating conditions and assessment levels affect ...
R. Brewer, W.W.D. Wyatt
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Optical semiconductor device reliability
Microelectronics Reliability, 2002Abstract Based on the degradation modes and mechanisms clarified in 1980s and 1990s, reliability of laser diodes and photodiodes is discussed for application to current optical fiber networks such as communication systems employing wavelength-division-multiplexing technique (WDM), high-frequency modulation technique, etc.
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Semiconductor network reliability assessment
Proceedings of the IEEE, 1964The paper discusses the reliability test plan and test results on semiconductor network microelectronic devices. Included in the test plan are reliability programs, life testing, step stress testing, and environmental tests. The failure analysis-corrective action cycle is discussed at length.
J. Adams, W. Workman
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Reliability of MgAI Semiconductor Interconnects
IEEE Transactions on Reliability, 1970Data are presented comparing 1-percent MgAI wire with 1-percent SiAI wire for ultrasonically bonded interconnects on semiconductor devices. The effects of annealing time and temperature on the strength of the wire demonstrate the mechanical superiority of the 1-percent MgAI wire.
John M. Pankratz, Dean R. Collins
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Semiconductor Device Reliability
1989I. Reliability Testing.- 1.1 The Influence of Temperature and Use Conditions on the Degradation of LED Parameters.- 1.2 An Historical Perspective of GaAs MESFET Reliability Work at Plessey.- 1.3 Screening and Burn-In: Application to Optoelectronic Device Selection for High-Reliability S280 Optical Submarine Repeaters.- 1.4 Assuring the Reliability of ...
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Reliability investigation of semiconductor coolers
XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291), 2002The life tests on the thermoelectric shock of semiconductor coolers show that the life of semiconductor coolers follows the Weibull distribution. After the early failed devices are removed, the failure rule of the devices can be described as an exponential distribution. The main failure mode is the crack between electric couple material and welding pad.
null Liu Zhenmao +7 more
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Durability and Reliability of Semiconductor Devices
MRS Proceedings, 1998AbstractThe aim of the study is to discuss the most general aspects of semiconductor devices durability and reliability. The life time of a semiconductor device is related to the defect structure evolution of the crystalline and noncrystalline components involved.
V. G. Sidorov +2 more
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Semiconductor Memory Reliability
2009This chapter contains sections titled: General Reliability Issues RAM Failure Modes and Mechanisms Nonvolatile Memory Reliability Reliability Modeling and Failure Rate Prediction Design for Reliability Reliability Test Structures Reliability Screening and Qualification This chapter contains sections ...
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