Results 301 to 310 of about 120,829 (333)

Reliability of compound semiconductor devices

2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400), 2002
This paper reviews the reliability problems of compound semiconductor devices. These devices suffer from specific failure mechanisms, which are related to their limited maturity. Only the GaAs MESFETs exhibit a stable technology and an assessed reliability. The metallizations employed in HEMTs already benefit from this assessment.
F. Fantini, L. Cattani, D. Dieci
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Semiconductor Memory Reliability

2009
This chapter contains sections titled: General Reliability Issues RAM Failure Modes and Mechanisms Nonvolatile Memory Reliability Reliability Modeling and Failure Rate Prediction Design for Reliability Reliability Test Structures Reliability Screening and Qualification This chapter contains sections ...
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Semiconductor device reliability vs process quality

Microelectronics Reliability, 1992
Abstract This paper describes a method for defining a quantitative model relating “quality” expressed in terms of parameter distributions and “reliability” expressed in terms of failure rates. This model makes it possible to generate a more realistic failure rate estimate for semiconductor devices.
Riko Radojcic, Paul Giotta
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Reliability evaluation of semiconductor using ultrasound

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2002
The semiconductor packaging industry is spending a great deal of time and effort developing thinner and thinner packages. Ultrasound works by measuring the amount of signal reflected from material interfaces. Thin packages create a potential problem because the resultant reflected signal from the die top and die attach layers can be nearly superimposed
null Hyoseong Jang, null Job Ha, null Kyungyoung Jhang, null Joonhyun Lee   +3 more
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Practical applications of semiconductor reliability modeling

2015 Annual Reliability and Maintainability Symposium (RAMS), 2015
A practical methodology for modeling the reliability of deep submicron (
Lori E. Bechtold, Florian Moliere, David A. Sunderland, Bahig Tawfellos   +3 more
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High Reliability Absolute Semiconductor Pressure Sensor

SAE Technical Paper Series, 1983
<div class="htmlview paragraph">This paper describes an absolute semiconductor pressure sensor suitable for the engine control systems in automobiles. Using the passive (electrically nonconnected) side of a sensor chip as the pressure interface, it has good pressure media compatibility.
M. Bessho, Y. Tsuru, H. Horiike, M. Jinmon, K. Yamagami, S. Wataya   +5 more
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Reliable electron bombarded semiconductor power devices

1973 International Electron Devices Meeting, 1973
During the earlier development of EBS devices, degradation mechanisms imposed severe limitations on achievable performance and operating life. Essentially all of the difficulties have been overcome and a number of devices have now operated for many thousands of hours at high average power with no failures.
A. Silzars, D.J. Bates, A. Ballonoff, G. Taylor   +3 more
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Reliability Of Ingaasp Semiconductor Lasers

SPIE Proceedings, 1987
The degradation mechanisms and reliability assurance strategies of InGaAsP semiconductor lasers that are currently being used in many commercial lightwave systems are discussed.
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Reliability assurance of individual semiconductor components

Proceedings of the IEEE, 1974
Where small numbers of highly reliable semiconductor devices are required, conventional methods of procurement are found to have deficiencies. An approach to procurement is proposed which is cost effective, accommodates new device types, and assures reliability in the individual device.
R.F. Haythornthwaite, A.R. Molozzi, D.V. Sulway   +2 more
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Reliability assessment of power semiconductor devices

2016 19th International Symposium on Electrical Apparatus and Technologies (SIELA), 2016
This paper concerns some issues related to failures that occurred in power semiconductor devices. A review of basic requirements aimed at normal and reliable operation of semiconductor components is done by using reliability prediction approaches and prognostic methods.
Anton Georgiev, Toncho Papanchev, Nikolay Nikolov   +2 more
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