Results 301 to 310 of about 119,011 (331)
Some of the next articles are maybe not open access.
Semiconductor reliability for the next century
Physics World, 1993The electronics industry now routinely produces devices with up to 1000 million transistors on a single semiconductor chip and this VLSI (very-large-scale integration) revolution shows no sign of stopping. As computer memory requirements push VLSI microfabrication technologies to new extremes, the next generation of dynamic random access memory (DRAM ...
openaire +1 more source
On the Relationship of Semiconductor Yield and Reliability
IEEE Transactions on Semiconductor Manufacturing, 2005Traditionally, semiconductor reliability has been estimated from the life tests or accelerated stress tests at the completion of manufacturing processes. Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reliability.
K.O. Kim, M.J. Zuo, W. Kuo
openaire +1 more source
Reliability of compound semiconductor devices
2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400), 2002This paper reviews the reliability problems of compound semiconductor devices. These devices suffer from specific failure mechanisms, which are related to their limited maturity. Only the GaAs MESFETs exhibit a stable technology and an assessed reliability. The metallizations employed in HEMTs already benefit from this assessment.
F. Fantini, L. Cattani, D. Dieci
openaire +1 more source
Reliability Testing of Semiconductor Devices in a Humid Environment
Journal of the IEST, 1993The influence of humidity on semiconductor device reliability is investigated with two main purposes: to emphasize the role of humidity in the failure process as a stress factor and to model the reliability-humidity relationship. Experiments were performed on two types of plastic encapsulated semiconductor devices (optoelectronic and ICs).
M. Bazu, M. Tazlauanu
openaire +1 more source
Reliability evaluation of semiconductor using ultrasound
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2002The semiconductor packaging industry is spending a great deal of time and effort developing thinner and thinner packages. Ultrasound works by measuring the amount of signal reflected from material interfaces. Thin packages create a potential problem because the resultant reflected signal from the die top and die attach layers can be nearly superimposed
null Hyoseong Jang +3 more
openaire +1 more source
Reliability Of Ingaasp Semiconductor Lasers
SPIE Proceedings, 1987The degradation mechanisms and reliability assurance strategies of InGaAsP semiconductor lasers that are currently being used in many commercial lightwave systems are discussed.
openaire +1 more source
Reliability of semiconductor devices - The need for simulation
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011Reliability requirements for semiconductor devices have increased tremendously in the past years. However, product qualification is still dominated by standard stress test procedures. Despite improved approaches that have entered the discussion recently, testing alone will not suffice to prove very low failure rates.
openaire +1 more source
Reliability Issue in Compound Semiconductor Heterojunction Devices
1998The failure mechanisms affecting electron devices based on compound semiconductors are reviewed.
FANTINI, Fausto +8 more
openaire +3 more sources
Reliability of semiconductor devices
1959 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1959openaire +1 more source