Results 61 to 70 of about 19,586 (287)
The precise identification and non-destructive measurement of structural features and defects in semiconductor wafers are essential for ensuring process integrity and sustaining high yield in advanced manufacturing environments.
Thi Thu Ha Vu +9 more
doaj +1 more source
Acoustic micro-imaging based on high-frequency ultrasound has been widely and effectively used for microdefect detection in microelectronic packages. With the miniaturization of microelectronic devices and the reduction of defects, edge blurring occurs ...
Lei Su +4 more
doaj +1 more source
Flip chip technology has been widely used in various fields. As the density of the solder balls in flip chip technology is increasing, the pitch among solder balls is narrowing, and the size effect is more significant. Therefore, the micro defects of the
Xiaonan Yu +5 more
doaj +1 more source
Vertical organic electrochemical transistors (vOECTs) are limited in speed by ion‐impermeable metal electrodes that slow ion injection. Using ion‐permeable PBFDO top electrodes allows direct vertical ion injection into BBL channels, achieving high current densities (>400 A cm−2), large on/off ratios (>106), and ultrafast switching in 28 µs. This sets a
Han‐Yan Wu +14 more
wiley +1 more source
Metasurface‐engineered NC‐TENG arrays integrate tactile pressure mapping, non‐contact gesture sensing, and acoustic signal readouts in one ultrathin module, and outperforms pristine PDMS in terms of electrical output and real‐time spatial mapping for next‐gen wearables.
Injamamul Arief +12 more
wiley +1 more source
Laser‐Assisted Phase Engineering of 2D MoS2 for Efficient Solution‐Processed Electronics
Here, local laser‐assisted phase transition from solution‐processed phase‐pure 1T′ to 2H MoS2 is shown to critically depend on the irradiation atmosphere. While processing in air leads to damaged insulating regions, inert conditions yield semiconducting 2H domains, enabling direct field‐effect transistor patterning with optimized lateral 1T′‐2H MoS2 ...
Anna Zhuravlova +10 more
wiley +1 more source
QUANTITATIVE SCANNING LASER ACOUSTIC MICROSCOPY : ATTENUATION
This paper describes recent technology improvements in Scanning Laser Acoustic Microscopy (SLAM) which make high resolution (25-50 micron) measurements of the spatial dependence of the attenuation coefficient practical. These measurements are not readily
M.G. ORAVECZ
core +1 more source
A transparent, deformable stevia–PVA hydrogel triboelectric nanogenerator delivers significantly enhanced mechanical strength and electrical output through biomimetic hydrogen‐bonded networks. Coupled with machine learning–assisted signal recognition, the self‐powered hydrogel enables accurate human‐motion sensing for intelligent wearable and IoT ...
Thien Trung Luu +5 more
wiley +1 more source
Noninvasive Subcellular Imaging Using Atomic Force Acoustic Microscopy (AFAM)
We report an imaging approach applying the atomic force acoustic microscopy (AFAM), which has unique potential for nondestructive imaging of cell internal structures.
Xiaoqing Li +5 more
doaj +1 more source
Scanning electron-acoustic microscopy of Bi_2Sr_2CaCu_2O_x
© 1993 Published by Elsevier Ltd.The temperature dependence of scanning electron acoustic microscopy (SEAM) and cathodoluminescence signals of B_i2Sr_2CaCu_2O_x samples have been measured.
Domínguez-Adame Acosta, Francisco +2 more
core +1 more source

