Results 151 to 160 of about 426,415 (276)
Flanking‐Group Engineering Unlocks Emerging Functionalities in Diketopyrrolopyrrole Semiconductors
This review presents a comprehensive and unified perspective of flanking‐group engineering in Diketopyrrolopyrrole (DPP) based organic semiconductors that connects molecular‐level design with cross‐device functionalities. By integrating insights from molecular design, solid‐state packing, and device physics, this review seeks to establish general ...
Xiaoyun Wu +5 more
wiley +1 more source
Reconfigurable skin electronics enabled by intrinsically stretchable photoelectric memory transistors. [PDF]
Park SH +8 more
europepmc +1 more source
Assessing the Role of Benzylic C─H Bonds in Suppressing Radical Chemistry Initiated by Benzynes
2,6‐Diphenyliodobenzene and 2,4,6‐triphenyliodobenzene act as initiators of BHAS coupling reactions to benzene in the presence of KOtBu. Experiments reveal that the original substrate, 2,6‐methyliodibenzene (2014) was far less efficient because its benzylic C─H bonds acted to quench reactive radicals.
Seb Tyerman +3 more
wiley +1 more source
A Highly Permeable and Three-Dimensional Integrated Electronic System for Wearable Human-Robot Interaction. [PDF]
Wang W +5 more
europepmc +1 more source
In this study, chemical compatibilization by radiation‐induced grafting is combined with EVA‐assisted physical compatibilization to enhance the properties of recycled polyethylene/GTR blends. The influence of mixing sequence on morphology, mechanical performance and dynamical properties is evaluated, demonstrating the importance of simultaneously ...
Kiss L. +3 more
wiley +1 more source
Exploring Wide-Range Alkyl Bridge Length Variations in Polymer Semiconductors: From Pristine to Blend Films for High-Mobility Stretchable TFTs. [PDF]
Kang H +15 more
europepmc +1 more source
Lightweight Modification of Polypropylene Cable Insulation Materials Doped with Hollow Glass Microspheres. [PDF]
Zhao X +7 more
europepmc +1 more source
ABSTRACT Ultrathin, lightweight, and mechanically compliant electromagnetic interference (EMI) shields are increasingly required for high‐frequency electronic devices. However, conventional metallic shields predominantly rely on conductivity‐driven reflection mechanisms, which become ineffective at reduced thickness and may cause severe secondary ...
Zida Zhang +7 more
wiley +1 more source

