MOFs and COFs in Electronics: Bridging the Gap between Intrinsic Properties and Measured Performance
Metal‐organic frameworks (MOFs) and covalent organic frameworks (COFs) hold promise for advanced electronics. However, discrepancies in reported electrical conductivities highlight the importance of measurement methodologies. This review explores intrinsic charge transport mechanisms and extrinsic factors influencing performance, and critically ...
Jonas F. Pöhls, R. Thomas Weitz
wiley +1 more source
Schottky-gated transistors using chitosan extracted from marine crab. [PDF]
Fukuhara M +5 more
europepmc +1 more source
Defects Dynamic in Photo‐Excited CeO2 and their Influence on CO2 Photoreduction
X‐ray photoelectron spectroscopy study under light excitation is presented to track the defect dynamic (Ce4+ to Ce3+) in CeO2. Surface enhanced Raman spectroscopy confirmed the key role of Ce3+ states in controlling charge and energy transfer across the CeO2‐dye molecule interface.
Rambabu Yalavarthi +3 more
wiley +1 more source
Retraction of "N<sub>2</sub>/H<sub>2</sub> Plasma-Enhanced Atomic Layer Deposition for SiO<sub>2</sub> Gap Filling: Implications for Nanoelectronics in Semiconductor Manufacturing". [PDF]
Okasha S, Munson D, Yoshikawa J.
europepmc +1 more source
THERMAL WAVE PROBING OF THE OPTICAL, ELECTRONIC AND THERMAL PROPERTIES OF SEMICONDUCTORS
Danièle Fournier, Benoı̂t C. Forget
openalex +2 more sources
Multicolor optoelectronic synapses are realized by vertically integrating solution‐processed MoS2 thin‐film and SWCNT. The electronically disconnected but interactive MoS2 enables photon‐modulated remote doping, producing a bi‐directional photoresponse.
Jihyun Kim +8 more
wiley +1 more source
MXene alloy-based metal-semiconductor contact for low-resistive field-effect transistors. [PDF]
Bera S, Kaushik D, Kumar H.
europepmc +1 more source
Device Integration Technology for Practical Flexible Electronics Systems
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa +5 more
wiley +1 more source
Deep reinforcement learning for scheduling semiconductor cluster tools in varying configurations. [PDF]
Choi J, Kim SB.
europepmc +1 more source

