Results 51 to 60 of about 1,614,070 (292)

Research on Power Semiconductor Converter Technology for Rail Transit Applications

机车电传动, 2020
The core of the development of high-power converter technology lies in power semiconductor technology. The iterative optimization of traditional silicon-based power semiconductor devices and the gradually maturity of new wide-band gap material ...
Yu QI, Zechun DOU, Rongjun DING
doaj  

A Buck-Boost Converter Modified to Utilize 600V GaN Power Devices in a PV Application Requiring 1200V Devices

Advances in Electrical and Computer Engineering, 2015
This paper presents a buck-boost converter which is modified to utilize new 600 V gallium nitride (GaN) power semiconductor devices in an application requiring 1200 V devices.
SRDIC, S., DESPOTOVIC, Z.
doaj   +1 more source

Symmetry‐Guided Multifunctional Acoustic System Based on Mechanically Actuated Sonic Crystals

Advanced Engineering Materials, EarlyView.
This study presents the design, simulation, and experimental validation of amultifunctional acoustic metamaterial based on rotationally engineered sonic crystals.By tuning cylinder orientations, controllable band gaps and six distinct functionalities—including switching, topological insulation, beam splitting, and logic operations—areachieved ...
Yuanyan Zhao, Sriram Subramanian, Gianluca Memoli   +2 more
wiley   +1 more source

Comparison between two VSC-HVDC transmission systems technologies : modular and neutral point clamped multilevel converter [PDF]

, 2009
The paper presents a detail comparison between two voltage source converter high voltage dc transmission systems, the first is based on neutral point-clamped (also known as HVDC-Light) and the second is based on innovative modular multilevel converter ...
Anaya-Lara, O., Finney, S.J., Burt, G.M., Adam, G.P., Williams, B.W., McDonald, J.R.   +5 more
core   +3 more sources

Transformer-Less Switched-Capacitor Quasi-Switched Boost DC-DC Converter

Energies, 2021
In this article, a quasi-switched boost converter based on the switched-capacitor technique with high step-up voltage capability is dealt with and analyzed.
Truong-Duy Duong, Minh-Khai Nguyen, Tan-Tai Tran, Young-Cheol Lim, Joon-Ho Choi   +4 more
doaj   +1 more source

Leveraging Symbolic Artificial Intelligence and Fuzzy Logic for Materials Science: A Review of Methods, Challenges, and Applications to Scarce and Imperfect Experimental Data

Advanced Engineering Materials, EarlyView.
This article explores the transformative potential of symbolic artificial intelligence (AI) in the field of materials science, particularly in leveraging experimental data. The article presents several symbolic AI models and discusses their applications in materials science.
Ahmed Amrani, Mohamed‐Ali Belloum, Laurence Boudet, Valentin Fouillard, Edwin Friedmann, Guillaume Lacharme, Ali Mahmoud, Jean‐Philippe Poli   +7 more
wiley   +1 more source

AN SiC‐based soft‐switching and self‐power supply MMC for MVDC

IET Power Electronics, 2023
Here, a novel modular multilevel converter (MMC) and its associated control scheme are proposed for medium‐voltage direct‐current (MVDC) distribution systems. The voltage gain and power can achieve wide‐range expansion by expanding sub‐modules.
Shaohua Zhang, Lejia Sun, Xuan Xue, Hongliang Lv, Renxu Jia   +4 more
doaj   +1 more source

Performance evaluation of ZVS/ZCS high efficiency AC/DC converter for high power applications [PDF]

Bulletin of the Polish Academy of Sciences: Technical Sciences, 2020
The increased power density, reduced switching losses with minimum electromagnetic interference (EMI), and high efficiency are essential requirements of power converters.
A. Ali, J. Chuanwen, M.M. Khan, S. Habib, Y. Ali   +4 more
doaj   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

Converter circuit design, semiconductor device selection and analysis of parasitics for micropower electrostatic generators [PDF]

, 2006
Published ...
Holmes, AS, Miao, P, Green, TC, Yeatman, EM, Stark, BH, Mitcheson, PD   +5 more
core   +1 more source