Results 151 to 160 of about 1,982,092 (286)

Physics-Based Device Models and Progress Review for Active Piezoelectric Semiconductor Devices. [PDF]

Sensors (Basel), 2020
Oh H, Dayeh SA.
europepmc   +1 more source

Nitride MXenes Beyond Carbides: Bridging the Gap Between Computational Prediction and Experimental Realization

Advanced Functional Materials, EarlyView.
Nitride MXenes remain constrained by a persistent gap between computational prediction and experimental realization. This Review identifies the thermodynamic, kinetic, and chemical barriers limiting their synthesis, critically evaluates emerging fabrication routes, and proposes a multidimensional computational‐experimental framework to accelerate the ...
Naresh Varnakavi, Masoud Soroush
wiley   +1 more source

High-Performance Carbon Nanotube Electronic Devices: Progress and Challenges

As silicon-based complementary metal-oxide-semiconductor (CMOS) technology approaches its physical and scaling limits at sub-3-nanometer nodes, critical challenges including the short-channel effect (SCE), surging power consumption, and aggravated ...
Zirui Zhang, Zhiyong Zhang, Nie Zhang
core   +1 more source

Metal electrodes transfer using polycarbonate for the fabrication of molybdenum disulfide semiconductor devices. [PDF]

Discov Nano
Chiang CH, Wang RY, Chou JT, Chiu YP, Chu CW, Chen YW, Chen GT, Su ZR, Chen C, Kang CF, Huang JR, Tsai ML.   +11 more
europepmc   +1 more source

Photoinduced Interfacial Electronic Modulation in Fe2O3‐BiVO4 Heterostructures for Enhanced Photo‐Assisted Zn‐Air Batteries

Advanced Functional Materials, EarlyView.
Light irradiation activates the Fe2O3‐BiVO4 heterostructure, enabling efficient solar‐electrochemical coupling in zinc‐air batteries. The built‐in electric field drives directional charge separation, guiding photoelectrons toward oxygen reduction sites and accumulating holes for oxygen evolution, thereby reducing polarization and enhancing discharge ...
Yili Liu, Zhenjiang Du, Enming Liu, Hongzhou Dong, Jianguang Feng, Beili Pang, Lifeng Dong, Liyan Yu   +7 more
wiley   +1 more source

Editorial for Special Issue "High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition". [PDF]

Micromachines (Basel)
Xu C, Liu Y, Chen Y.
europepmc   +1 more source

Out‐of‐Plane Strain‐Decoupled Architecture for High‐Fill‐Factor Stretchable OLED Displays

Advanced Functional Materials, EarlyView.
A vertically decoupled multilayer SOLED architecture separates emissive pixel islands from deformable interconnects, allowing low‐modulus elastomeric layers to accommodate applied strain and suppress strain transfer to the OLED region. This design, combined with transparent hybrid encapsulation, enables a high fill factor (∼75%), stretchability ...
Young Hyun Son, Kyung Cheol Choi, Jeong Hyun Kwon   +2 more
wiley   +1 more source

Virtualization as a New Scaling Law for Semiconductor Devices Beyond Geometric Scaling. [PDF]

Small
Wang Z, Chen X, Lin F, Li X, Wang F, Guo S, Yu S, Li L, Huang JK.   +8 more
europepmc   +1 more source

Full‐Field Damage Monitoring in Architected Lattices Using In situ Electrical Impedance Tomography

Advanced Functional Materials, EarlyView.
In situ electrical impedance tomography (EIT) turns 3D‐printed, CNT‐infused architected lattices into full‐field damage‐imaging systems. Tunable Voronoi‐based geometries act as active sensing architectures, enabling conductivity maps to detect early‐stage damage and localise sequential ligament fracture before catastrophic failure.
Akash Deep, Andrea Samore, Alistair McEwan, Andrew McBride, Shanmugam Kumar   +4 more
wiley   +1 more source