Results 111 to 120 of about 123,224 (272)
Interface Effects in Ultrathin Silicon on Insulator Films
This work establishes a systematic framework to discriminate how bulk and interface phenomena affect charge transport in ultrathin P‐doped silicon‐on‐insulator (SOI) films. For Si films below 15 nm, electrical characterization demonstrates that interface states drive charge transport, shifting the metal‐insulator transition (MIT) critical dopant ...
Andrea Pulici +8 more
wiley +1 more source
Active semiconductor fibers and devices
Unary and compound semiconductors have been deposited into microstructured optical fibers to make junction-based fiber devices, very high power infrared fibers, mid-infrared fiber lasers, and nonlinear hydrogenated amorphous silicon ...
Peacock, A.C. +6 more
core
Highlights The lanthanide compound of TbCl3 improved the wettability of Me-4PACz and further enhanced crystallization, in which the additional Cl− ions passivate iodine vacancy and improve energy level alignment at buried interface.
Wenming Chai +10 more
doaj +1 more source
Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices. [PDF]
Kwon S, Park J, Kim K, Cho Y, Lee M.
europepmc +1 more source
A cooperative and competitive interrelationship between alcohol oxidation (AOR) and water oxidation (OER) was observed on a typical anode catalyst of Ni2P. In situ Raman spectroscopy and electrochemical analyses revealed a specific complementary mechanism between them, in which OER and AOR critically contribute to the activity and stability of anodic ...
Yong Yan +10 more
wiley +1 more source
Microspheres give improved resolution in nondestructive examination of semiconductor devices. [PDF]
Woods RC.
europepmc +1 more source
Sulfur‐doped graphitized carbon nanofibers act as adaptive catalyst–support platforms, enabling dynamic sulfur‐mediated reconstruction and strong metal–support interactions. This unique behavior enhances catalyst stability and controls reaction pathways, achieving highly selective urea oxidation (∼92% N2) coupled with efficient hydrogen evolution ...
Melanie Guillén‐Soler +4 more
wiley +1 more source
Delamination of Plasticized Devices in Dynamic Service Environments
With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices.
Wenchao Tian +4 more
core +1 more source
All‐solution‐processed, low‐cost extended short‐wavelength infrared photodetectors are realized by coupling colloidal HgTe quantum dots to plasmonic In2O3:Sn,F nanocrystals. Localized surface plasmon resonances boost and spectrally tailor light absorption between 1500 and 3000 nm, enabling responsivities above 40 A W−1.
Kseniia A. Sergeeva +9 more
wiley +1 more source
Multiphoton Lithography of Organic Semiconductor Devices for 3D Printing of Flexible Electronic Circuits, Biosensors, and Bioelectronics. [PDF]
Dadras-Toussi O +5 more
europepmc +1 more source

