Results 71 to 80 of about 22,477 (237)

550kV SF6/N2充气母线绝缘性能研究

open access: yesGaoya dianqi, 2014
由于SF6气体的温室效应,减少SF6气体的使用具有深远的社会意义,用SF6/N2混合气体取代纯SF6气体作为高压电器设备的绝缘介质是减少使用SF6气体的有效措施。介绍了SF6/N2混合气体的优点。从气体放电理论出发,对不同比例SF6/N2混合气体的绝缘性能进行了分析,结果表明:SF6体积分数仅为20%的SF6/N2混合气体击穿强度为相同气体压力纯SF6的70%左右;若SF6体积分数为20%的SF6/N2混合气体的击穿强度要达到纯SF6气体的击穿强度,其总压力应为纯SF6气体的1.4倍 ...
牛文军, 魏俊梅, 张铎, 孙永恒
doaj  

Evaluation of SF6 Leakage from Gas Insulated Equipment on Electricity Networks in Great Britain

open access: yesEnergies, 2018
This paper examines the data collected from the power industry over the last six years of actual reported emissions of sulphur hexafluoride (SF6) and the potential impact.
Phillip Widger   +1 more
doaj   +1 more source

Simulation‐Driven Optimization of a Borosilicate/Al/Al2O3/Graphene Multilayer SPR Sensor for Aqueous Detection of Metal Ions and Their Binary Mixtures

open access: yesElectron, EarlyView.
A cost‐effective surface plasmon resonance sensor using a borosilicate prism, 60 nm aluminum, an optimized 8–10 nm Al2O3 spacer, and graphene oxide achieves up to 338(°)/RIU sensitivity with narrow linewidth, enabling reliable detection and discrimination of Hg(II), Pb(II), Zn(II), and their binary mixtures in water.
Talia Tene   +4 more
wiley   +1 more source

Investigation of insulation properties and synergistic effects in CF3I/N2 gas mixtures using the Boltzmann equation [PDF]

open access: yesAIP Advances
CF3I is regarded as a highly promising substitute for SF6; however, due to its high boiling point, buffer gases such as N2 must be blended. To evaluate the feasibility of replacing SF6 and its mixtures with CF3I/N2, a comparative analysis was conducted ...
Ziyuan Wang   +4 more
doaj   +1 more source

Generating Helical Polymorphic Beams Using Dielectric Metasurfaces

open access: yesLaser &Photonics Reviews, EarlyView.
Helix‐shaped polymorphic beams are optical fields whose intensity maxima spiral around the propagation axis, enabling particle manipulation through attractive or repulsive forces. Traditionally requiring expensive spatial light modulators, metasurfaces now provide a compact, cost‐effective alternative. This work demonstrates general helical polymorphic
Maryam Setareh   +3 more
wiley   +1 more source

Highly Sensitive Photoacoustic Multi-Gas Detection of SF6 Decomposition Components

open access: yesPhotonic Sensors
The photoacoustic spectroscopy apparatus based on an external cavity quantum cascade laser was employed to simultaneously detect four SF6 decomposition by-products, i.e., SO2F2, SOF2, CF4, and SO2 for the application in diagnostics of the SF6 insulation ...
Qianhe WEI   +3 more
doaj   +1 more source

Characterization and Repetition Rate Locking of a 1 GHz Erbium‐Doped ZBLAN Waveguide‐Chip Comb Laser

open access: yesLaser &Photonics Reviews, EarlyView.
A compact, erbium‐doped ZBLAN waveguide chip mode‐locked laser that self‐starts, delivers stable ultrashort pulses, and repetition rate locked to a 1 GHz radio‐frequency reference. The laser produces near transform‐limited 324 fs pulses and 12 nm bandwidth with low noise and long‐term stability, with potential applications in optical frequency ...
Wen Qi Zhang   +4 more
wiley   +1 more source

Átviteli hálózati alállomásokon alkalmazott SF6 szigetelésű megszakítók diagnosztikai vizsgálata

open access: yes, 2022
Az alaphálózati alállomások üzemelő megszakítóinak, mint szerkezetnek, megszakító analizátor segítségével a pillanatnyi műszaki-üzemállapotának meghatározása mérések és vizsgálatok alapján.
György, Dávid
core  

Two-Level Fault Diagnosis of SF6 Electrical Equipment Based on Big Data Analysis

open access: yesBig Data and Cognitive Computing, 2019
With the increase of the operating time of sulphur hexafluoride (SF6) electrical equipment, the different degrees of discharge may occur inside the equipment.
Hongxia Miao   +4 more
doaj   +1 more source

Capacitively Coupled SF6, SF6/O2, SF6/CH4 Plasma Etchingof Acrylic at Low Vacuum Pressure

open access: yesKorean Journal of Materials Research, 2009
This study investigated dry etching of acrylic in capacitively coupled SF , SF /O and SF /CH plasma under a low vacuum pressure. The process pressure was 100 mTorr and the total gas flow rate was fixed at 10 sccm. The process variables were the RIE chuck power and the plasma gas composition. The RIE chuck power varied in the range of 25~150 W.
openaire   +2 more sources

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