Results 61 to 70 of about 8,354 (256)

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

open access: yesAdvanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco   +8 more
wiley   +1 more source

Study on the Effect of Solid Solution Treatment on the Bending Fatigue Property of Fe-Mn-Si Shape Memory Alloys

open access: yesMetals
Fe-Mn-Si shape memory alloys have excellent low-cycle fatigue performance and broad application prospects in the field of civil engineering and construction.
Haojie Niu, Yubin Sun, Chengxin Lin
doaj   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

open access: yesAdvanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa   +19 more
wiley   +1 more source

Study on notch tensile properties of Fe-Mn-Si shape memory alloy

open access: yesMaterials Research Express
In order to investigate the effect of stress concentration on the mechanical properties of Fe-Mn-Si shape memory alloy, Fe17Mn5Si10Cr5Ni shape memory alloy was selected as the research object in this study.
Haojie Niu, Yubin Sun, Chengxin Lin
doaj   +1 more source

Phase diagram of FeNiCoAlTaB ferrous shape memory alloy on aging time

open access: yesAIP Advances, 2017
Ferrous shape memory alloy, Fe41Ni28Co17Al11.5Ta2.5B0.05, has shown large superelastic strain and strength in previous study. In the fabrication of this alloy, aging process is crucial for the formation of shape memory effect/superelasticity.
Zhijian Zhou, Jian Cui, Xiaobing Ren
doaj   +1 more source

Integration of Low‐Voltage Nanoscale MoS2 Memristors on CMOS Microchips

open access: yesAdvanced Functional Materials, EarlyView.
This article presents the first monolithic integration of nanoscale MoS2‐based memristors into the back‐end‐of‐line of foundry‐fabricated CMOS microchips in a one‐transistor‐one‐resistor (1T1R) architecture. The MoS2‐based 1T1R cells exhibit forming‐free, nonvolatile resistive switching with ultra‐low operating voltages, low cycle‐to‐cycle variability ...
Jimin Lee   +16 more
wiley   +1 more source

Optoelectronic Synaptic Devices Using Molecular Telluride Phase‐Change Inks for Three‐Factor Learning

open access: yesAdvanced Functional Materials, EarlyView.
Optoelectronic synaptic devices based on solution‐processed molecular telluride GST‐225 phase‐change inks are demonstrated for three‐factor learning. A global optical signal broadcast through a silicon waveguide induces non‐volatile conductance updates exclusively in locally electrically flagged memristors.
Kevin Portner   +14 more
wiley   +1 more source

Self‐Sintering Ionogel Binder for Flexible, Recyclable, and Healable Printed Giant Magnetoresistive Sensors

open access: yesAdvanced Functional Materials, EarlyView.
ABSTRACT Electronic waste has emerged as a major environmental challenge, driven by the massive consumption and a limited lifetime of modern electronic devices, stimulating the development of sustainable electronics. Here, an all‐biomaterial gelatin‐choline‐citric acid ([Ch][CA]) ionogel is developed as an active binder to realize self‐sintered ...
Lin Guo   +10 more
wiley   +1 more source

Influence of Fe on shape memory effect of Ni-Mn-Ga alloy microwire

open access: yesCailiao gongcheng
The shape memory effect of alloy microwire with Fe replacing Ga based on Ni-Mn-Ga alloy microwire was analyzed. Ni-Mn-Ga-Fe alloy was prepared by vacuum tungsten arc melting furnace and the parent alloy was prepared by a high vacuum precision melt ...
LIU Yanfen   +4 more
doaj   +1 more source

Oxygen‐Tunnel Indium Tin Oxide Vertical Channel Transistors with Enhanced Current Density and Reliability for Monolithic 3D Compute‐In‐Memory Systems

open access: yesAdvanced Functional Materials, EarlyView.
Oxygen‐tunnel (OT) indium tin oxide (ITO) vertical channel transistors (VCTs) enable reliable, high‐density gain‐cell memory for monolithic 3D integration. A sandwiched SiN/SiO2/SiN OT stack selectively regulates oxygen transport, suppressing parasitic electrode oxidation while stabilizing channel oxygen vacancies, thereby suppressing carrier injection
Hyeonho Gu   +17 more
wiley   +1 more source

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