Results 61 to 70 of about 3,726,775 (282)

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Shape memory effect and compositional dependence of Zr-Cu binary and Zr-Cu-Al ternary alloys

Mechanical Engineering Journal, 2017
The intermetallic compound ZrCu experiences a transformation from a parent phase into a martensitic phase with rapid cooling. ZrCu possesses considerable promise as a high-temperature shape memory alloy.
Hitoo TOKUNAGA, Hideki YOSHIOKA
doaj   +1 more source

Adaptive Tunable Vibration Absorber using Shape Memory Alloy [PDF]

Mechanics of Advanced Composite Structures, 2015
This study presents a new approach to control the nonlinear dynamics of an adaptive absorber using shape memory alloy (SMA) element. Shape memory alloys are classified as smart materials that can remember their original shape after deformation.
Shirko Faroughi
doaj   +1 more source

Design and Development of High-Strength and Ductile Ternary and Multicomponent Eutectoid Cu-Based Shape Memory Alloys: Problems and Perspectives

Metals, 2022
An overview is presented on the structural and phase transformations and physical and mechanical properties of those multicomponent copper-based shape memory alloys which demonstrate attractive commercial potential due to their low cost, good shape ...
Vladimir G. Pushin, Nataliya N. Kuranova, Alexey E. Svirid, Alexey N. Uksusnikov, Yurii M. Ustyugov   +4 more
doaj   +1 more source

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

Advanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco, Valerio Francesco Annese, Valerio Galli, Ilaria Penna, Debora Russo, Marina Veronesi, Rita Scarpelli, Stefania Sabella, Mario Caironi   +8 more
wiley   +1 more source

High-temperature shape memory properties of Cu15Ni35Ti25Hf12.5Zr12.5 high-entropy alloy

Journal of Materials Research and Technology, 2021
The major challenges hindering the application of high-temperature shape memory alloys are their decreased mechanical strength and thermal stability. Herein, we present high-temperature shape memory properties of the Cu15Ni35Ti25Hf12.5Zr12.5 high-entropy
Shan-Hsiu Chang, Wei-Pin Kao, Kai-Yuan Hsiao, Jien-Wei Yeh, Ming-Yen Lu, Che-Wei Tsai   +5 more
doaj   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

Advanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa, Milan Buttberg, Ke Ran, Rana Walied Ahmad, Dennis Braun, Lukas Völkel, Jimin Lee, Sofía Cruces, Bart Macco, Bárbara Canto, Holger Lerch, Thorsten Wahlbrink, Holger Kalisch, Michael Heuken, Andrei Vescan, Joachim Mayer, Zhenxing Wang, Ilia Valov, Stephan Menzel, Max C. Lemme   +19 more
wiley   +1 more source

Integration of Low‐Voltage Nanoscale MoS2 Memristors on CMOS Microchips

Advanced Functional Materials, EarlyView.
This article presents the first monolithic integration of nanoscale MoS2‐based memristors into the back‐end‐of‐line of foundry‐fabricated CMOS microchips in a one‐transistor‐one‐resistor (1T1R) architecture. The MoS2‐based 1T1R cells exhibit forming‐free, nonvolatile resistive switching with ultra‐low operating voltages, low cycle‐to‐cycle variability ...
Jimin Lee, Sofía Cruces, Xiaohua Liu, Yang Chen, Vasilis A. Maroufidis, Janghyun Jo, Lukas Völkel, Dennis Braun, Michael Möller, Leon Brackmann, Holger Kalisch, Michael Heuken, Andrei Vescan, Rafal E. Dunin‐Borkowski, Joachim Mayer, Stefan Wiefels, Max C. Lemme   +16 more
wiley   +1 more source

Study on the Effect of Solid Solution Treatment on the Bending Fatigue Property of Fe-Mn-Si Shape Memory Alloys

Metals
Fe-Mn-Si shape memory alloys have excellent low-cycle fatigue performance and broad application prospects in the field of civil engineering and construction.
Haojie Niu, Yubin Sun, Chengxin Lin
doaj   +1 more source

Optoelectronic Synaptic Devices Using Molecular Telluride Phase‐Change Inks for Three‐Factor Learning

Advanced Functional Materials, EarlyView.
Optoelectronic synaptic devices based on solution‐processed molecular telluride GST‐225 phase‐change inks are demonstrated for three‐factor learning. A global optical signal broadcast through a silicon waveguide induces non‐volatile conductance updates exclusively in locally electrically flagged memristors.
Kevin Portner, Dhananjeya Kumaar, Giacomo Torti, Killian Keller, Till Zellweger, Florian M. Schenk, Christoph Weilenmann, Daniel Chelladurai, Vara Prasad Jonnalagadda, Ghazi Sarwat Syed, Vanessa Wood, Jürg Leuthold, Alexandros Emboras, Maksym Yarema, Mathieu Luisier   +14 more
wiley   +1 more source