Results 301 to 310 of about 521,402 (361)
The effect of resveratrol application on the micro-shear bond strength of adhesive to bleached enamel. [PDF]
Cengiz-Yanardag E, Karakaya I.
europepmc +1 more source
This review article explores applications in wearable sensors such as mechanical, electrophysiological, and gas sensors, highlighting advancements that improve device performance and predictability. In addition to analyzing graphene's synthesis techniques, including traditional and advanced laser‐based methods, the article discusses fabrication ...
Fatemeh Saeedi+2 more
wiley +1 more source
Shear bond strength evaluation of new computer-aided design - computer-aided manufacturing chromium-cobalt alloy (Sintron) with two different types of cement: An in vitro study. [PDF]
Khanmohammadi MM+4 more
europepmc +1 more source
The supergravity and in‐situ evaporation are utilized to produce GO thin films with a record‐high mechanical strength of 540 MPa. The supergravity confines the 2D flakes within a very thin layer and creates a large all‐directional shear stress to induce the superalignment, while in‐situ evaporation accelerates the dehydration and facilitates the ester ...
Dawei Zhang+10 more
wiley +1 more source
Shear bond strength in two types of indirect orthodontic cementation. [PDF]
Munive-Mendez AA+2 more
europepmc +1 more source
4D Bioprinted Self‐Folding Scaffolds Enhance Cartilage Formation in the Engineering of Trachea
A bilayer self‐folding scaffold, triggerable by humidity, is fabricated via 4D bioprinting for trachea engineering. An analytical model is derived to predict its radius of curvature, enabling its scalability. Cartilage progenitor cells seeded on the scaffold perceive scaffold final curvature and react to it, by enhancing the upregulation of pro ...
Irene Chiesa+4 more
wiley +1 more source
Comparing the Effects of Different Cleansing Agents on the Shear Bond Strength of Resin Cements on Surface-Contaminated Zirconia: An In Vitro Study. [PDF]
Karthikeyan S+5 more
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya+3 more
wiley +1 more source