Results 81 to 90 of about 332,485 (313)
Planar Solid‐State Nanopores Toward Scalable Nanofluidic Integration Based on CMOS Technology
We present a scalable silicon‐based fabrication strategy for planar solid‐state nanopores to enable their integration with complex nanofluidic systems. Prototype devices demonstrate normal voltage‐current characteristics, good noise performance, and appreciable streaming currents. Our CMOS‐compatible fabrication process offers precise geometric control
Ngan Hoang Pham +7 more
wiley +1 more source
Der Test (DiWi) erfasst das deklarative Faktenwissen über verschiedene Diversitätsbereiche von (angehenden) Lehrkräften. Er liegt in einer Langform (DiWi: 142 Items) und einer Kurzform (DiWi-K: 36 Items) mit den fünf Subskalen Förderschwerpunkt ...
Steinmayr, R., Tometten, L., Heyder, A.
core +1 more source
A hierarchical porous copper current collector is fabricated via three‐dimensional printing combined with pressureless sintering to stabilize lithium metal anodes. The interconnected architecture lowers local current density, guides uniform Li deposition within pores, and suppresses dendrite growth.
Alok Kumar Mishra, Mukul Shukla
wiley +1 more source
In order to study the change characteristics of electromagnetic torque in the transient process of stator internal short circuit fault, based on virtual work principle in dynamic, the electromagnetic torque of transient process after stator winding ...
CHEN Chao +3 more
doaj +1 more source
Soft Mechanical‐Electrical Logic Using Liquid Metal‐Filled 3D‐Printed Architectures
We present 3D‐printed soft mechanical–electrical logic elements that use liquid metal–filled silicone tubes actuated by thermoplastic polyurethane/polylactic acid (TPU/PLA) architectures to produce Boolean operations. Complementary normally open and normally closed unit cells perform repeatable binary transitions and can be combined into more complex ...
Christoph Lehmann +2 more
wiley +1 more source
Graphene nanoplatelet (0.1 wt.%) reinforcement significantly enhances the performance of β Ti‐28Nb‐35.4Zr alloy. Grain refinement, reduced water contact angle, and improved surface characteristics promote osteoblast adhesion and complete surface coverage after 7 days.
Khurram Munir +5 more
wiley +1 more source
Investigation into voltage and process variation-aware manufacturing test
Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality.
Ingelsson, Bo Urban
core
Scandium (Sc)‐doped AlCoCrFeMo HEA coatings are fabricated via flame spraying with 0.1, 0.3, and 0.5 wt% Sc additions. Among these, the HEA‐Sc0.3 coating exhibits the highest corrosion resistance, indicated by a more positive corrosion potential and lower current density.
Pankaj Kumar +7 more
wiley +1 more source
Thermal-Safe Test Scheduling for Core-Based System-on-a-Chip Integrated Circuits
Overheating has been acknowledged as a major problem during the testing of complex system-on-chip (SOC) integrated circuits. Several power-constrained test scheduling solutions have been recently proposed to tackle this problem during system integration.
Rosinger, Paul +2 more
core
Telehealth Usability Questionnaire – German version
Die deutsche Version des Telehealth Usability Questionnaire (G-TUQ) dient der Bewertung der Gebrauchstauglichkeit/Usability von Telehealth-Implementierungen und -Diensten, wie bspw. Digitalen Gesundheitsanwendungen (DiGAs).
Zimmermann, J. +2 more
core +1 more source

