Results 131 to 140 of about 1,360,403 (285)
Direct Mode‐Resolved Measurement of Interfacial Phonon Transport by Acoustic Phonon Reflectometry
Advanced Materials Interfaces, EarlyView.We introduce a novel analysis, acoustic phonon reflectometry, that measures the mode‐resolved phonon reflection coefficient at semiconductor interfaces. In aluminum nitride, we observe excellent agreement with the acoustic mismatch model across three distinct interfaces.
Christopher Hennighausen +9 more
wiley +1 more source
Mechanical Stress Evolution in Polycrystalline Ge Thin Films Under MeV Ion Irradiation
Advanced Materials Interfaces, EarlyView.Irradiation of polycrystalline Ge thin films with 1.8 MeV Au ions alters residual stress through defect generation and lattice expansion. Increasing fluence drives progressive lattice disorder and eventual amorphization. Polycrystalline Ge resists amorphization longer than crystalline Ge, as grain boundaries facilitate defect diffusion, significantly ...
Karla J. Paz Corrales +10 more
wiley +1 more source
Advanced Materials Interfaces, EarlyView.Atmospheric‐pressure RF plasma deposition enables the fabrication of transparent, superhydrophobic coatings with anti‐reflective functionality. Process optimization yields high optical transmittance, robust environmental stability, and self‐cleaning properties.
Sultan S. Ussenkhan +7 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.This study presents a new biodegradable coating for titanium implants using a natural antimicrobial peptide, caerin 1.9. Applied via solvent casting, the coating offers sustained antibacterial protection and promotes healing. Tested on 3D‐printed porous titanium scaffolds, it effectively prevented infection—including against resistant bacteria—while ...
Hejie Li +7 more
wiley +1 more source
Deformation and fracture of single-crystal and sintered polycrystalline silicon carbide produced by cavitation [PDF]
An investigation was conducted to examine the deformation and fracture behavior of single-crystal and sintered polycrystalline SiC surfaces exposed to cavitation.
Buckley, Donald H. +3 more
core +1 more source
Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives
Advanced Materials Technologies, EarlyView.Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley +1 more source
Using of the Modern Semiconductor Devices Based on the SiC
Advances in Electrical and Electronic Engineering, 2008 This paper deals with possibility of application of the semiconductor devices based on the SiC (Silicon Carbide) inthe power electronics. Basic synopsis of SiC based materials problems are presented, appreciation of their properties incomparison with ...
Pavel Drabek
doaj
Additive Manufacturing of Ni‐Based Thermoelectric Materials for Waste Heat Recovery
Advanced Materials Technologies, EarlyView.Thermoelectric generators convert waste heat into electricity but are constrained by conventional fabrication. Here, laser powder bed fusion enables direct printing of customised n‐type Cu60Ni40 and p‐type Ni90Cr10 legs. The assembled module achieves 0.8% efficiency at ΔT = 419 K, demonstrating scalable additive manufacturing of eco‐friendly, design ...
Karolin Amstein +6 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.Liquid metal additives are processed in elastomer host resulting in highly conductive and stretchable composites. The material functions as a piezoresistive sensor with minimal drift, low stiffness, and enhanced operating range. The film can replace wires to charge a mobile phone at ∼350% strain and monitors bodily motion in real‐time via a portable ...
Patryk Wojciak +3 more
wiley +1 more source
Advanced Science, EarlyView.By adjusting Ga's doping in Cu–Sn alloy, an ultra‐high elongation of 100.8% is achieved in first time. Ga forms a stable solid solution structure and a stronger electron exchange with Cu. This enhances strength‐ductility synergistically by tuning SFE to balance twinning and slip.
Dazhuo Song +15 more
wiley +1 more source