Mitigating side channel attacks on FPGA through deep learning and dynamic partial reconfiguration. [PDF]
Bommana SR +3 more
europepmc +1 more source
Naofumi Homma, Takafumi Aoki
openaire +2 more sources
Mg–Zn composites with a thickness of 0.21 mm were fabricated using roll bonding of a kirigami‐patterned Mg alloy inlay within a Zn matrix. Thermal activation following this process led to the formation of tailored intermetallic structures, which provided the composite with enhanced flexural strength.
Yaroslav Frolov +4 more
wiley +1 more source
Deep learning-based improved side-channel attacks using data denoising and feature fusion. [PDF]
Huang H +5 more
europepmc +1 more source
Phase Field Failure Modeling: Brittle‐Ductile Dual‐Phase Microstructures under Compressive Loading
The approach by Amor and the approach by Miehe and Zhang for asymmetric damage behavior in the phase field method for fracture are compared regarding their fitness for microcrack‐based failure modeling. The comparison is performed for the case of a dual‐phase microstructure with a brittle and a ductile constituent.
Jakob Huber, Jan Torgersen, Ewald Werner
wiley +1 more source
SAluMC: Thwarting Side-Channel Attacks via Random Number Injection in RISC-V. [PDF]
Dang S +4 more
europepmc +1 more source
Multimodal Data‐Driven Microstructure Characterization
A self‐consistent autonomous workflow for EBSP‐based microstructure segmentation by integrating PCA, GMM clustering, and cNMF with information‐theoretic parameter selection, requiring no user input. An optimal ROI size related to characteristic grain size is identified.
Qi Zhang +4 more
wiley +1 more source
Optimizing cryptographic protocols against side channel attacks using WGAN-GP and genetic algorithms. [PDF]
Singh P, Pranav P, Dutta S.
europepmc +1 more source
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source
3D printer audio and vibration side channel dataset for vulnerability research in additive manufacturing security. [PDF]
Madamopoulos C, Tsoutsos NG.
europepmc +1 more source

