Results 1 to 10 of about 633,776 (299)
Aluminum nitride on insulator: Material and processing optimization for integrated photonic applications [PDF]
EPJ Web of Conferences, 2023 Thin film aluminum nitride on insulator (AlNOI) has gained attention as a promising material platform for integrated photonic circuits (PICs) due to its ability to operate over a wide spectral range covering the ultra-violet to mid-infrared regions ...
Spettel Jasmin +9 more
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EPJ Photovoltaics, 2023 Within this work the impact of contact materials with higher volume resistivity as leaded solder are investigated in terms of comparability of the current conduction through the joint. An approach was developed to experimentally determine the qualitative
Großer Stephan +3 more
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Varifocal MEMS mirrors for high-speed axial focus scanning: a review
Microsystems & Nanoengineering, 2023 Recent advances brought the performance of MEMS-based varifocal mirrors to levels comparable to conventional ultra-high-speed focusing devices. Varifocal mirrors are becoming capable of high axial resolution exceeding 300 resolvable planes, can achieve ...
Jaka Pribošek +2 more
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Silicon–silicon π single bond [PDF]
Nature Communications, 2020 AbstractA carbon–carbon double bond consists of a σ bond and a π bond. Recently, the concept of a π single bond, where a π bond is not accompanied by a σ bond, has been proposed in diradicals containing carbon and heteroatom radical centers. Here we report a closed-shell compound having a silicon–silicon π single bond.
Soichiro Kyushin +7 more
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NPG Asia Materials, 2023 Capacitors based on ABO3-type perovskite oxides show considerable promise for overcoming the limitations of nanoscale integration with dynamic random access memory (DRAM) devices.
Jeongil Bang +10 more
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EPJ Photovoltaics, 2023 It was previously shown that the Laser Enhanced Contact Optimization (LECO) Process is a promising boost for PERC and TOPCon cell manufacturing enhancement.
Krassowski Eve +4 more
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Energies, 2021 Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can ...
Ali Roshanghias +9 more
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Silicon – single molecule – silicon circuits
Chemical Science, 2021 Single-molecule circuits using silicon contacts are robust, conductive, controllable, and highly reproducible in blinking experiments, with enhanced conductance in break-junctions owing to residual dangling bonds.
Jeffrey R. Reimers +3 more
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Screening COVID-19 by Swaasa AI platform using cough sounds: a cross-sectional study
Scientific Reports, 2023 The Advent of Artificial Intelligence (AI) has led to the use of auditory data for detecting various diseases, including COVID-19. SARS-CoV-2 infection has claimed more than six million lives to date and therefore, needs a robust screening technique to ...
Padmalatha Pentakota +18 more
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Low Power Compact 3D-Constructed AlScN Piezoelectric MEMS Mirrors for Various Scanning Strategies
Micromachines, 2023 In this paper, the newly developed 3D-constructed AlScN piezoelectric MEMS mirror is presented. This paper describes the structure and driving mechanism of the proposed mirror device, covering its driving characteristics in both quasi-static and resonant
Jeong-Yeon Hwang +6 more
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