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Roadmapping the next generation of silicon photonics [PDF]
In order to complete the transition to the era of large-scale integration, silicon photonics will have to overcome several challenges. Here, the authors outline what these challenges are and what it will take to tackle them.
S. Shekhar +6 more
semanticscholar +1 more source
Aluminum nitride on insulator: Material and processing optimization for integrated photonic applications [PDF]
Thin film aluminum nitride on insulator (AlNOI) has gained attention as a promising material platform for integrated photonic circuits (PICs) due to its ability to operate over a wide spectral range covering the ultra-violet to mid-infrared regions ...
Spettel Jasmin +9 more
doaj +1 more source
Silicon heterojunction (SHJ) solar cells have reached high power conversion efficiency owing to their effective passivating contact structures. Improvements in the optoelectronic properties of these contacts can enable higher device efficiency, thus ...
Hao Lin +15 more
semanticscholar +1 more source
Within this work the impact of contact materials with higher volume resistivity as leaded solder are investigated in terms of comparability of the current conduction through the joint. An approach was developed to experimentally determine the qualitative
Großer Stephan +3 more
doaj +1 more source
Varifocal MEMS mirrors for high-speed axial focus scanning: a review
Recent advances brought the performance of MEMS-based varifocal mirrors to levels comparable to conventional ultra-high-speed focusing devices. Varifocal mirrors are becoming capable of high axial resolution exceeding 300 resolvable planes, can achieve ...
Jaka Pribošek +2 more
doaj +1 more source
Silicon–silicon π single bond [PDF]
AbstractA carbon–carbon double bond consists of a σ bond and a π bond. Recently, the concept of a π single bond, where a π bond is not accompanied by a σ bond, has been proposed in diradicals containing carbon and heteroatom radical centers. Here we report a closed-shell compound having a silicon–silicon π single bond.
Soichiro Kyushin +7 more
openaire +3 more sources
Capacitors based on ABO3-type perovskite oxides show considerable promise for overcoming the limitations of nanoscale integration with dynamic random access memory (DRAM) devices.
Jeongil Bang +10 more
doaj +1 more source
It was previously shown that the Laser Enhanced Contact Optimization (LECO) Process is a promising boost for PERC and TOPCon cell manufacturing enhancement.
Krassowski Eve +4 more
doaj +1 more source
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can ...
Ali Roshanghias +9 more
doaj +1 more source
Silicon – single molecule – silicon circuits
Single-molecule circuits using silicon contacts are robust, conductive, controllable, and highly reproducible in blinking experiments, with enhanced conductance in break-junctions owing to residual dangling bonds.
Jeffrey R. Reimers +3 more
openaire +4 more sources

