Results 1 to 10 of about 2,011,192 (371)

Fluorescent Silicon Clusters and Nanoparticles [PDF]

open access: yes, 2017
The fluorescence of silicon clusters is reviewed. Atomic clusters of silicon have been at the focus of research for several decades because of the relevance of size effects for material properties, the importance of silicon in electronics and the potential applications in bio-medicine.
Dasog   +12 more
arxiv   +3 more sources

Specific heat of aluminium-doped superconducting silicon carbide [PDF]

open access: yes, 2009
The discoveries of superconductivity in heavily boron-doped diamond, silicon and silicon carbide renewed the interest in the ground states of charge-carrier doped wide-gap semiconductors. Recently, aluminium doping in silicon carbide successfully yielded a metallic phase from which at high aluminium concentrations superconductivity emerges.
J Akimitsu   +8 more
arxiv   +3 more sources

Silicon‐Based Anodes for Lithium‐Ion Batteries: From Fundamentals to Practical Applications

open access: yesSmall, 2018
Silicon has been intensively studied as an anode material for lithium-ion batteries (LIB) because of its exceptionally high specific capacity. However, silicon-based anode materials usually suffer from large volume change during the charge and discharge ...
Kun Feng   +2 more
exaly   +2 more sources

Aluminum nitride on insulator: Material and processing optimization for integrated photonic applications [PDF]

open access: yesEPJ Web of Conferences, 2023
Thin film aluminum nitride on insulator (AlNOI) has gained attention as a promising material platform for integrated photonic circuits (PICs) due to its ability to operate over a wide spectral range covering the ultra-violet to mid-infrared regions ...
Spettel Jasmin   +9 more
doaj   +1 more source

Local resolution of currents through electrical joints consisting of materials with different conductivity

open access: yesEPJ Photovoltaics, 2023
Within this work the impact of contact materials with higher volume resistivity as leaded solder are investigated in terms of comparability of the current conduction through the joint. An approach was developed to experimentally determine the qualitative
Großer Stephan   +3 more
doaj   +1 more source

Varifocal MEMS mirrors for high-speed axial focus scanning: a review

open access: yesMicrosystems & Nanoengineering, 2023
Recent advances brought the performance of MEMS-based varifocal mirrors to levels comparable to conventional ultra-high-speed focusing devices. Varifocal mirrors are becoming capable of high axial resolution exceeding 300 resolvable planes, can achieve ...
Jaka Pribošek   +2 more
doaj   +1 more source

Interface engineering for substantial performance enhancement in epitaxial all-perovskite oxide capacitors

open access: yesNPG Asia Materials, 2023
Capacitors based on ABO3-type perovskite oxides show considerable promise for overcoming the limitations of nanoscale integration with dynamic random access memory (DRAM) devices.
Jeongil Bang   +10 more
doaj   +1 more source

Assessing the long-term stability of laser enhanced contact optimization (LECO) treated PERC cells in PV modules by extended indoor and outdoor durability tests

open access: yesEPJ Photovoltaics, 2023
It was previously shown that the Laser Enhanced Contact Optimization (LECO) Process is a promising boost for PERC and TOPCon cell manufacturing enhancement.
Krassowski Eve   +4 more
doaj   +1 more source

Review of Silicon Photonics Technology and Platform Development

open access: yesJournal of Lightwave Technology, 2021
Many breakthroughs in the laboratories often do not bridge the gap between research and commercialization. However, silicon photonics bucked the trend, with industry observers estimating the commercial market to close in on a billion dollars in 2020 [45].
Shawn Yohanes Siew   +12 more
semanticscholar   +1 more source

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

open access: yesEnergies, 2021
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can ...
Ali Roshanghias   +9 more
doaj   +1 more source

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