Results 21 to 30 of about 1,443,984 (310)

Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

open access: yesMicromachines, 2022
Most current thermal MEMS use fragile structures such as thin-film membranes or microcantilevers for thermal isolation. To increase the robustness of these devices, solid thermal insulators that are compatible with MEMS cleanroom processing are needed ...
Ole Behrmann   +2 more
doaj   +1 more source

Silicon consumption and population density changes of dominant planktonic diatoms in Lake Constance [PDF]

open access: yes, 1983
(1) Interactions between silicon concentration and diatom growth have been studied in Lake Constance with data on number and volume of cells per unit volume of water and concentration of dissolved reactive silicon. (2) Concentration of dissolved reactive
Sommer, Ulrich, Stabel, H.-H.
core   +1 more source

Correlation of Scale Factor Non-Linearity and Vibration Rectification Error in Vibrating Beam Accelerometers

open access: yesIEEE Access
Vibration Rectification Error (VRE) is a critical parameter for high-performance accelerometers operating in dynamic environments. This paper presents a focused experimental study to rigorously investigate the relationship between VRE and Scale Factor ...
Theo Miani   +6 more
doaj   +1 more source

Sustainable Multifunctional Biface Sensor Tag

open access: yesAdvanced Sensor Research, 2023
In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The sensor tag combines three different environmental sensors in one single platform for the dedicated purpose of wireless structural health monitoring of a ...
Lukas Rauter   +11 more
doaj   +1 more source

Additive Manufacturing for Nano-Feature Applications: Electrohydrodynamic Printing as a Next-Generation Enabling Technology

open access: yesIEEE Open Journal of Nanotechnology, 2022
Regardless of the technology, additive or subtractive, the miniaturization trend is constantly pushing for smaller resolutions. The rise of global challenges in material availability, fabrication in three dimensions (3D), design flexibility and rapid ...
Goran Miskovic, Robin Kaufhold
doaj   +1 more source

Increased Cycling Efficiency and Rate Capability of Copper-coated Silicon Anodes in Lithium-ion Batteries

open access: yes, 2011
Cycling efficiency and rate capability of porous copper-coated, amorphous silicon thin-film negative electrodes are compared to equivalent silicon thin-film electrodes in lithium-ion batteries. The presence of a copper layer coated on the active material
Kowolik, Kristin   +2 more
core   +1 more source

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

open access: yesSensors, 2020
With the growing significance of printed sensors on the electronics market, new demands on quality and reproducibility have arisen. While most printing processes on standard substrates (e.g., Polyethylene terephthalate (PET)) are well-defined, the ...
Johanna Zikulnig   +3 more
doaj   +1 more source

Understanding of the Retarded Oxidation Effects in Silicon Nanostructures [PDF]

open access: yes, 2012
In-depth understanding of the retarded oxidation phenomenon observed during the oxidation of silicon nanostructures is proposed. The wet thermal oxidation of various silicon nanostructures such as nanobeams, concave/convex nanorings and nanowires ...
Han, X. -L., Krzeminski, C., Larrieu, G.
core   +3 more sources

Raman Spectroscopy and Spectral Signatures of AlScN/Al2O3

open access: yesMicromachines, 2022
III-V solid solutions are sensitive to growth conditions due to their stochastic nature. The highly crystalline thin films require a profound understanding of the material properties and reliable means of their determination.
Dmytro Solonenko   +4 more
doaj   +1 more source

High Temperature Magnetic Cores Based on PowderMEMS Technique for Integrated Inductors with Active Cooling

open access: yesMicromachines, 2022
The paper presents the realization and characterization of micro-inductors with core with active cooling capability for future integrated DC/DC converter solutions operating with wide bandgap semiconductors at high temperatures with high power densities.
Malte Paesler   +2 more
doaj   +1 more source

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