Results 11 to 20 of about 1,778,075 (341)

Aluminum nitride on insulator: Material and processing optimization for integrated photonic applications [PDF]

open access: yesEPJ Web of Conferences, 2023
Thin film aluminum nitride on insulator (AlNOI) has gained attention as a promising material platform for integrated photonic circuits (PICs) due to its ability to operate over a wide spectral range covering the ultra-violet to mid-infrared regions ...
Spettel Jasmin   +9 more
doaj   +1 more source

Local resolution of currents through electrical joints consisting of materials with different conductivity

open access: yesEPJ Photovoltaics, 2023
Within this work the impact of contact materials with higher volume resistivity as leaded solder are investigated in terms of comparability of the current conduction through the joint. An approach was developed to experimentally determine the qualitative
Großer Stephan   +3 more
doaj   +1 more source

Varifocal MEMS mirrors for high-speed axial focus scanning: a review

open access: yesMicrosystems & Nanoengineering, 2023
Recent advances brought the performance of MEMS-based varifocal mirrors to levels comparable to conventional ultra-high-speed focusing devices. Varifocal mirrors are becoming capable of high axial resolution exceeding 300 resolvable planes, can achieve ...
Jaka Pribošek   +2 more
doaj   +1 more source

Interface engineering for substantial performance enhancement in epitaxial all-perovskite oxide capacitors

open access: yesNPG Asia Materials, 2023
Capacitors based on ABO3-type perovskite oxides show considerable promise for overcoming the limitations of nanoscale integration with dynamic random access memory (DRAM) devices.
Jeongil Bang   +10 more
doaj   +1 more source

Assessing the long-term stability of laser enhanced contact optimization (LECO) treated PERC cells in PV modules by extended indoor and outdoor durability tests

open access: yesEPJ Photovoltaics, 2023
It was previously shown that the Laser Enhanced Contact Optimization (LECO) Process is a promising boost for PERC and TOPCon cell manufacturing enhancement.
Krassowski Eve   +4 more
doaj   +1 more source

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

open access: yesEnergies, 2021
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can ...
Ali Roshanghias   +9 more
doaj   +1 more source

Screening COVID-19 by Swaasa AI platform using cough sounds: a cross-sectional study

open access: yesScientific Reports, 2023
The Advent of Artificial Intelligence (AI) has led to the use of auditory data for detecting various diseases, including COVID-19. SARS-CoV-2 infection has claimed more than six million lives to date and therefore, needs a robust screening technique to ...
Padmalatha Pentakota   +18 more
doaj   +1 more source

Low Power Compact 3D-Constructed AlScN Piezoelectric MEMS Mirrors for Various Scanning Strategies

open access: yesMicromachines, 2023
In this paper, the newly developed 3D-constructed AlScN piezoelectric MEMS mirror is presented. This paper describes the structure and driving mechanism of the proposed mirror device, covering its driving characteristics in both quasi-static and resonant
Jeong-Yeon Hwang   +6 more
doaj   +1 more source

Investigation of graded channel effect on analog/linearity parameter analysis of junctionless surrounded gate graded channel MOSFET

open access: yesSN Applied Sciences, 2023
Linearity analysis of nanoscale devices is a vital issue as nonlinearity behavior is exhibited by them when employed in circuits for microwave and RF applications.
Sarita Misra   +3 more
doaj   +1 more source

A 316MP, 120FPS, High Dynamic Range CMOS Image Sensor for Next Generation Immersive Displays

open access: yesSensors, 2023
We present a 2D-stitched, 316MP, 120FPS, high dynamic range CMOS image sensor with 92 CML output ports operating at a cumulative date rate of 515 Gbit/s.
Abhinav Agarwal   +12 more
doaj   +1 more source

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