Results 31 to 40 of about 1,754,208 (336)

Superconducting Diamond on Silicon Nitride for Device Applications [PDF]

, 2018
Chemical vapour deposition (CVD) grown nanocrystalline diamond is an attractive material for the fabrication of devices. For some device architectures, optimisation of its growth on silicon nitride is essential.
Bland, Henry A., Jones, Tyrone G., Klemencic, Georgina M., Mandal, Soumen, Morgan, David J., Papageorgiou, Andreas, Thomas, Evan L. H., Williams, Oliver A.   +7 more
core   +6 more sources

Silicone

, 2020
Silicone is an open-source Python package which infers anthropogenic emissions of missing species based on other known emissions. For example, it can infer nitrous oxide emissions in one scenario based on carbon dioxide emissions from that scenario plus the relationship between nitrous oxide and carbon dioxide emissions in other scenarios.
Lamboll, Robin D., Nicholls, Zebedee R. J, Kikstra, Jarmo S.   +2 more
openaire   +1 more source

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

Sensors, 2020
With the growing significance of printed sensors on the electronics market, new demands on quality and reproducibility have arisen. While most printing processes on standard substrates (e.g., Polyethylene terephthalate (PET)) are well-defined, the ...
Johanna Zikulnig, Ali Roshanghias, Lukas Rauter, Christina Hirschl   +3 more
doaj   +1 more source

Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

Micromachines, 2022
Most current thermal MEMS use fragile structures such as thin-film membranes or microcantilevers for thermal isolation. To increase the robustness of these devices, solid thermal insulators that are compatible with MEMS cleanroom processing are needed ...
Ole Behrmann, Thomas Lisec, Björn Gojdka   +2 more
doaj   +1 more source

Bond Strength Tests Between Silicon Wafers and Duran Tubes (Fusion Bonded Fluidic Interconnects) [PDF]

, 2005
The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented.
Berenschot, J.W., Boer, J.H. de, Elwenspoek, M.C., Fazal, I., Jansen, H.V.   +4 more
core   +2 more sources

Correlation of Scale Factor Non-Linearity and Vibration Rectification Error in Vibrating Beam Accelerometers

IEEE Access
Vibration Rectification Error (VRE) is a critical parameter for high-performance accelerometers operating in dynamic environments. This paper presents a focused experimental study to rigorously investigate the relationship between VRE and Scale Factor ...
Theo Miani, Lokesh Gurung, Douglas Young, Madan Parajuli, Guillermo Sobreviela-Falces, Colin Baker, Ashwin A. Seshia   +6 more
doaj   +1 more source

High Temperature Magnetic Cores Based on PowderMEMS Technique for Integrated Inductors with Active Cooling

Micromachines, 2022
The paper presents the realization and characterization of micro-inductors with core with active cooling capability for future integrated DC/DC converter solutions operating with wide bandgap semiconductors at high temperatures with high power densities.
Malte Paesler, Thomas Lisec, Holger Kapels   +2 more
doaj   +1 more source

Increased Cycling Efficiency and Rate Capability of Copper-coated Silicon Anodes in Lithium-ion Batteries

, 2011
Cycling efficiency and rate capability of porous copper-coated, amorphous silicon thin-film negative electrodes are compared to equivalent silicon thin-film electrodes in lithium-ion batteries. The presence of a copper layer coated on the active material
Kowolik, Kristin, Sethuraman, Vijay A., Srinivasan, Venkat   +2 more
core   +1 more source

Low dispersion integrated michelson interferometer on silicon on insulator for optical coherence tomography [PDF]

, 2011
We present an integrated silicon Michelson interferometer for OCT fabricated with wafer scale deep UV lithography. Silicon waveguides of the interferometer are designed with GVD less than 50 ps/nm. km. The footprint of the device is 0.5 mm x 3 mm.
Baets, Roel, Komorowska, Katarzyna, Yurtsever, Günay   +2 more
core   +1 more source

Radioactive silicon as a marker in thin-film silicide formation [PDF]

, 1977
A new technique using radioactive 31Si (half-life =2.62 h), formed in a nuclear reactor, as a marker for studying silicide formation is described. A few hundred angstroms of radioactive silicon is first deposited onto the silicon substrate, followed ...
Lau, S. S., Nicolet, M.-A., Pretorius, R., Ramiller, C. L.   +3 more
core   +1 more source