Results 81 to 90 of about 656,663 (291)

Silicon-plus photonics

, 2016
Silicon photonics has become very popular because of their compatibility with mature CMOS technologies. However, pure silicon is still very difficult to be utilized to obtain various photonic functional devices for large-scale photonic integration due to
Wu, Hao, Wang, Zhechao, Liu, Liu, Yin, Yanlong, Yu, Longhai, Liang, Di, Dai, Daoxin, Wang, ZhechaoUGent802000987719976352489580322F04E6-F0EE-11E1-A9DE-61C894A0A6B4   +7 more
core   +1 more source

Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

Advanced Materials, EarlyView.
“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair, Hrisheekesh Thachoth Chandran, Karl Leo, Hans Kleemann   +3 more
wiley   +1 more source

The Boston University Photonics Center annual report 2005-2006 [PDF]

, 2006
This repository item contains an annual report that summarizes activities of the Boston University Photonics Center in the 2005-2006 academic year. The report provides quantitative and descriptive information regarding photonics programs in education ...
The Boston University Photonics Center
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Germanium for photonic applications

, 2014
Localized GOI wires have been grown using a LPE process resulting in single crystal layers up to 400 µm in length and 5 µm in width. We have reported on the design, fabrication and characterisation of a 4-channel AMMI structure integrated with germanium ...
Khokhar, A.Z., Reed, G.T., Gardes, F.Y., Soler Penadés, Jordi, Mitchell, C.J., Mashanovich, G.Z., Littlejohns, C.G., C. G. Littlejohns, A. Z. Khokhar, J. Soler Penades, C. J. Mitchell, G. Z. Mashanovich, F. Y. Gardes, G. T. Reed   +13 more
core   +1 more source

Phase Engineering of Nanomaterials (PEN): Evolution, Current Challenges, and Future Opportunities

Advanced Materials, EarlyView.
This review summarizes the synthesis, phase transition, advanced characterization spanning ex situ to in situ and operando techniques, and diverse applications of phase engineering of nanomaterials (PEN). It further outlines key challenges and future opportunities, such as phase stability, architecture control, and artificial intelligence (AI)‐driven ...
Ye Chen, Zhanxi Fan, Jingjie Ge, Qiyuan He, Zhuangchai Lai, Jiawei Liu, Chaoliang Tan, Hua Zhang   +7 more
wiley   +1 more source

Integrated quantum photonics with single color centers in silicon

Color centers are promising candidates for quantum technologies due to their long coherence times and high-quality spin-photon interfaces. Silicon has recently emerged as a host for color centers operating in the telecommunication bands, in a ...
Prabhu, Mihika,, Raniwala, Hamza,, Chen, Changchen,, Colangelo, Marco,, Gerlach, Connor,, Saggio, Valeria,, Englund, Dirk,, Ornelas-Huerta, Dalia,, De Santis, Lorenzo,, Panuski, Chris,, Errando-Herranz, Carlos,, Gyger, Samuel,, Christen, Ian,   +12 more
core   +1 more source

Epitaxially Integrated Electro‐Optic KNbO3 Thin Films on Silicon

Advanced Materials, EarlyView.
We demonstrate the first epitaxial integration of electro‐optic KNbO3 thin films on silicon using suboxide molecular‐beam epitaxy. Combining adsorption‐controlled molecular‐beam epitaxy, advanced characterization, and phase‐field modeling, we demonstrate phase‐pure crystalline films mirroring bulk crystals with robust Pockels response, enabling future ...
Sankalpa Hazra, Tobias Schwaigert, Yingxin Zhu, Aiden Ross, Muhammad Aminul Haque Chowdhury, Shun‐Li Shang, Sameer Singh, Zhiyu Zhang, Zhe Wang, Brynn Brower, Saugata Sarker, Suchismita Sarker, Zi‐Kui Liu, Rama K. Vasudevan, Long‐Qing Chen, Yang Yang, Darrell G. Schlom, Venkatraman Gopalan   +17 more
wiley   +1 more source

g-Pack: a generic testbed package for silicon photonics devices

, 2008
g-Pack is a low-frequency packaging approach to breadboarding of Silicon photonics chips. It provides optical i/o through a fiber array coupled to gratings couplers, and multiple DC i/o through a pin grid array (PGA ...
Dumon, Pieter, T. Tekin, Schroder, H, P. Dumon, Tekin, T, H. Schroder, L. Zimmermann, Bogaerts, Wim, Zimmermann, L, W. Bogaerts, Zimmermann, L., Dumon, P., Schröder, H., Bogaerts, W., Tekin, T.   +14 more
core   +2 more sources

Giant Nonequilibrium Valley Control via Spin‐Selective Hot‐Carrier Transfer in an Antiferromagnetic van der Waals Stack

Advanced Materials, EarlyView.
Spin‐selective hot‐carrier transfer across CrSBr/WSe2/CrSBr interfaces couples the continuously tunable magnetic configuration of antiferromagnetic CrSBr to the valley degrees of freedom of monolayer WSe2, enabling giant nonequilibrium valley control and magnetic‐state‐dependent reversal of circularly polarized emission.
Ke Xiao, Jiabao Yang, Kai Feng, Yicheng Guan, James Caleb Peters, Ramona Hoffmann, Niels Schröter, Stuart S. P. Parkin   +7 more
wiley   +1 more source

Emerging heterogeneous integrated photonic platforms on silicon

Nanophotonics, 2015
Silicon photonics has been established as a mature and promising technology for optoelectronic integrated circuits, mostly based on the silicon-on-insulator (SOI) waveguide platform.
Fathpour Sasan
doaj   +1 more source