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Wafer-Scale Deterministic Fabrication of Axis-Ratio-Engineered Silicon Nanoparticles for On-Resonance Electric-Magnetic Dipole Interference. [PDF]
SmallKim T, Lee J.
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A silicon microneedle array atmospheric pressure plasma ionization source for real-time trace gas chemical analysis. [PDF]
Microsyst NanoengChew BS +6 more
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Improving 3C-SiC Quality Through Wafer-Bonded Switchback Epitaxy. [PDF]
Materials (Basel)Colston G +6 more
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2015
Abstract Semiconductor bulk crystals have to be cut into wafers for further applications. The dominant slicing technique both for microelectronic and photovoltaic applications is the multiwire sawing method. The requirements on the processes and wafer qualities depend on the material and the application.
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Abstract Semiconductor bulk crystals have to be cut into wafers for further applications. The dominant slicing technique both for microelectronic and photovoltaic applications is the multiwire sawing method. The requirements on the processes and wafer qualities depend on the material and the application.
openaire +1 more source
Wafer-to-wafer fusion bonding of oxidized silicon to silicon at low temperatures
Sensors and Actuators A: Physical, 1998Abstract In this paper a silicon wafer-to-wafer bonding process is presented where silicon dioxide is used as an intermediate layer. Because the process temperature is very low (120 °C) and because the chemical treatment of the surface before bonding does not damage aluminium patterns, wafers containing electronic circuity can be bonded.
A. Berthold, B. Jakoby, M.J. Vellekoop
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Silicon Wafer for the Gigabit Era
1998With the increasing integration density towards the Gigabit memory, the structure size (design rule) reduces from 0.35 μm to 0.25 μm and later to 0.18 μm. The latter 0.18 μm structure is to be expected at the turn of the century. Therefore the requirements which have to be fulfilled by the base material of the integrated circuits, the silicon wafers ...
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Fabrication of miniature silicon wafer fuel cells with improved performance
Journal of Power Sources, 2003Ping Cheng
exaly
A predictive model of grinding force in silicon wafer self-rotating grinding
International Journal of Machine Tools and Manufacture, 2016Fei Qin, Tong An, Pei Chen
exaly
Fine grinding of silicon wafers: a mathematical model for the wafer shape
International Journal of Machine Tools and Manufacture, 2004Z J Pei
exaly