Results 181 to 190 of about 54,444 (308)

Micropillar‐Engineered Hybrid Adhesive Patch for Surface‐Conformable and Directional Adhesion

Advanced Materials Technologies, EarlyView.
This work presents a surface‐conformable hybrid adhesive integrating height‐optimized hexagonal micropillars with open‐rectangular cuts. The micropillars enhance rough‐surface contact and microscale crack arrest, while the cuts guide and reverse interfacial cracks for strong and directional adhesion. The multiscale architecture achieves robust pull‐off
Seongjin Park, Dong Kwan Kang, Haejin Bae, Ho‐Sup Jung, Hoon Eui Jeong   +4 more
wiley   +1 more source

Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging. [PDF]

Polymers (Basel)
Wu J, Chen F, Liu J, Chen R, Liu P, Zhao H, Zhao Z.   +6 more
europepmc   +1 more source

Wafer-Level Testable High-Speed Silicon Microring Modulator Integrated with Grating Couplers

, 2010
A wafer-level testable silicon-on-insulator-based microring modulator is demonstrated with high modulation speed, to which the grating couplers are integrated as the fiber-to-chip interfaces.
Yu YD (Yu Yu-De), Li ZY (Li Zhi-Yong), Xiao X (Xiao Xi), Hu YT (Hu Ying-Tao), Yu JZ (Yu Jin-Zhong), Zhu Y (Zhu Yu), Xiao, X, Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, POB 912, Beijing 100083, Peoples R China. E-mail Address: yudeyu@semi.ac.cn, Xu HH (Xu Hai-Hua), Zhou LA (Zhou Liang), Li YT (Li Yun-Tao), jzyu@semi.ac.cn   +10 more
core  

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

Advanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane, Lyn I. Jones, Richard M. Martin, Helen Winter, Faezeh Arab Hassani   +4 more
wiley   +1 more source

Piezoelectric Micromachined Ultrasonic Transducers with Micro-Hole Inter-Etch and Sealing Process on (111) Silicon Wafer. [PDF]

Micromachines (Basel)
Wang Y, Wu S, Wang W, Wu T, Li X.
europepmc   +1 more source

Large‐Scale and Cost‐Effective Fabrication of Ultra‐Thin, Biodegradable Microelectrode Arrays and Pressure Sensors Using Laser Micromachining

Advanced Materials Technologies, EarlyView.
A mask‐free and cost‐effective UV‐pico‐second laser‐based microfabrication method is proposed to fabricate large‐area biodegradable microelectrode arrays and pressure sensors. These devices demonstrate low impedance, good conformability, excellent biocompatibility, and rapid degradation, providing a new route for next‐generation transient electronics ...
Bhavani Prasad Yalagala, Asfand Tanwear, María Cerezo‐Sánchez, Hossein Parvizi, Morteza Amjadi, Hadi Heidari   +5 more
wiley   +1 more source

Fabrication of Ordered Macropore Arrays in n-Type Silicon Wafer by Anodic Etching Using Double-Tank Electrochemical Cell. [PDF]

Micromachines (Basel)
Zhang J, Zhang F, Ma M, Liu Z.
europepmc   +1 more source

Low Temperature Wafer Level Packaging of RF-MEMS Using SU-8 Contact Printing

, 2006
Conventional fusion bonding technology requires high temperatures, thus it may generate thermal stress, due to different coefficient of thermal expansion in the bonded materials, and result in wafer warpage or even cracks.
Tian, J., Iannacci, Jacopo, Sosin, S., Bartek, M., Burghartz, J. N.   +4 more
core  

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

Advanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu, Mengyao Xiao, Zhouli Sui, Yinpeng Wang, Daoye Zheng, Yuxin Liu, Luwei Wang, Huajun Liu, Chengkuo Lee   +8 more
wiley   +1 more source

A Pressure Microsensor Made of Parylene‐C for Use as Medical Implant

Advanced Materials Technologies, EarlyView.
A monolithic parylene‐C pressure sensor with gold strain gauges provides 6.2 μV$\mu{\rm V}$·mmHg$\cdot{\rm mmHg}$−1$^{-1}$ sensitivity. The morphology of a sputtered thin film strain sensor is granular/columnar, which results in a high gauge factor of 7.5. Thermal bonding and parylene‐C coating create a hermetic cavity.
Ann‐Kathrin Klein, Victor Krajka, Andreas Dietzel   +2 more
wiley   +1 more source