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Biomedical Silicones: Leveraging Additive Strategies to Propel Modern Utility
ACS Macro Letters, 2023Silicones have a long history of use in biomedical devices, with unique properties stemming from the siloxane (Si–O–Si) backbone that feature a high degree of flexibility and chemical stability.
A. Marmo, M. Grunlan
semanticscholar +1 more source
Roles of silanes and silicones in forming superhydrophobic and superoleophobic materials
Journal of Materials Chemistry A, 2016Inspired by the self-cleaning and water-repellent properties of plants and animals in the natural world, superhydrophobic and superoleophobic materials develop quickly, and are of great interest in academic and industrial areas.
Junping Zhang, Lingxiao Li
exaly +2 more sources
Frontiers in Pharmacology, 2016 Siloxanes are commonly known as silicones. They belong to the organosilicon compounds and are exclusively obtained by synthesis. Their chemical structure determines a range of physicochemical properties which were recognized as unique.
Krystyna Mojsiewicz-pieńkowska +2 more
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From passive to emerging smart silicones
Reviews in chemical engineering, 2022Amassing remarkable properties, silicones are practically indispensable in our everyday life. In most classic applications, they play a passive role in that they cover, seal, insulate, lubricate, water-proof, weather-proof etc.
M. Cazacu +5 more
semanticscholar +1 more source
Thermal Processing of Silicones for Green, Scalable, and Healable Superhydrophobic Coatings
Advanced Materials, 2016 Xinchun Tian +2 more
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Custom 3D Printable Silicones with Tunable Stiffness
Macromolecular Rapid Communications, 2018 Silicone elastomers have broad versatility within a variety of potential advanced materials applications, such as soft robotics, biomedical devices, and metamaterials.
Jeremy M Lenhardt +2 more
exaly +2 more sources
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 1998
Abstract Problems and solutions concerning the gluing of silicon detectors are discussed. The R & D work for the HERA- B vertex detector system led to gluing studies with epoxy and silicone-based adhesives used on ceramics and carbon fibre. The HERA- B solution using a silicone glue is presented.
Abt, I. +8 more
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Abstract Problems and solutions concerning the gluing of silicon detectors are discussed. The R & D work for the HERA- B vertex detector system led to gluing studies with epoxy and silicone-based adhesives used on ceramics and carbon fibre. The HERA- B solution using a silicone glue is presented.
Abt, I. +8 more
openaire +3 more sources
Journal of The Electrochemical Society, 2006
We report the creation of two novel complementary metal oxide semiconductor CMOS -compatible platforms: strained-silicon onsilicon SSOS and strained-silicon on silicon-germanium on silicon SGOS . SSOS substrate has an epitaxially defined, strained-silicon layer directly on silicon wafer without an intermediate SiGe or oxide layer. SSOS is a homochemical
David M. Isaacson +5 more
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We report the creation of two novel complementary metal oxide semiconductor CMOS -compatible platforms: strained-silicon onsilicon SSOS and strained-silicon on silicon-germanium on silicon SGOS . SSOS substrate has an epitaxially defined, strained-silicon layer directly on silicon wafer without an intermediate SiGe or oxide layer. SSOS is a homochemical
David M. Isaacson +5 more
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Thromboresistance of Silicones Modified with PEO-Silane Amphiphiles.
ACS Biomaterials Science & Engineering, 2020The antifouling properties of poly(ethylene oxide) (PEO)-silane amphiphiles as surface-modifying additives (SMAs) in a condensation cure silicone have been previously demonstrated against simple protein solutions.
B. K. D. Ngo +7 more
semanticscholar +1 more source
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
Honeywell's new packaging technique uses silicon as a multichip substrate. Multiple integrated circuit (IC) chips are flip bonded by controlled collapse joining to a silicon substrate. The silicon substratc provides the interconnections between chips and the next level of interface.
W. Nunne +5 more
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Honeywell's new packaging technique uses silicon as a multichip substrate. Multiple integrated circuit (IC) chips are flip bonded by controlled collapse joining to a silicon substrate. The silicon substratc provides the interconnections between chips and the next level of interface.
W. Nunne +5 more
openaire +2 more sources